Light-emitting element transfer assembly and light-emitting element transfer method

A light-emitting element and transfer method technology, which is applied in the direction of electrical components, semiconductor devices, and electric solid devices, can solve the problems of affecting the time and accuracy of picking, affecting the yield of single picking, and decreasing the viscosity, so as to improve the picking rate. And transfer efficiency, increase the adhesive force, increase the effect of bonding area

Pending Publication Date: 2022-07-29
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

After the transfer head picks up the micro-luminescent components multiple times, there is a problem of decreased vi

Method used

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  • Light-emitting element transfer assembly and light-emitting element transfer method
  • Light-emitting element transfer assembly and light-emitting element transfer method
  • Light-emitting element transfer assembly and light-emitting element transfer method

Examples

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Example Embodiment

[0025] Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present invention by illustrating examples of the invention.

[0026] It should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompas...

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Abstract

The present invention discloses a light-emitting element transfer assembly and a light-emitting element transfer method, the light-emitting element transfer assembly comprising: a first substrate comprising a bonding area for bonding a light-emitting element; a plurality of patterned areas are arranged on at least one surface of the second substrate, each patterned area comprises a plurality of adhesive parts, and the adhesive parts can be connected with the to-be-bonded parts of the to-be-bonded light-emitting elements in an embedded mode. When the second substrate is in contact with the light-emitting element, the adhesive part of the second substrate can be connected with the to-be-bonded part of the to-be-bonded light-emitting element in an embedded manner, so that the bonding area between the adhesive part of the second substrate and the light-emitting element is effectively increased, and the bonding force of the second substrate to the light-emitting element is further increased; the pickup rate and the transfer efficiency of the light-emitting element by the second substrate are improved.

Description

technical field [0001] The invention belongs to the technical field of electronic products, and particularly relates to a light-emitting element transfer assembly and a light-emitting element transfer method. Background technique [0002] Micro-light-emitting elements have the advantages of high brightness, long life, fast response speed, and high contrast, but the current process yield is low. Batch transfer technology is the key technology of micro-light-emitting elements, in which the quality of the transfer head directly affects the pickup rate and pickup time of micro-light-emitting elements. After the transfer head picks up the micro-light-emitting element for many times, there is a problem of decreased viscosity, which will affect the yield of a single pick-up; multiple pick-up will affect the pick-up time and accuracy. [0003] Therefore, there is an urgent need for a new light-emitting element transfer assembly and a light-emitting element transfer method. SUMMAR...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L25/075
CPCH01L21/6835H01L25/0753H01L2221/68368
Inventor 李蒙蒙盛翠翠董小彪葛泳王程功
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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