Probe contacting system having plane adjusting mechanism

A technology of contact system and adjustment mechanism, which is applied in the direction of measuring leads/probes, parts of electrical measuring instruments, electronic circuit testing, etc., and can solve problems such as increasing system costs

Inactive Publication Date: 2007-02-28
株式会社鼎新
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because this conventional technology utilizes a conductive metal plate to establish conductive paths for all probe elements, it requires an extra time to install the metal plate and replace the metal plate with th

Method used

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  • Probe contacting system having plane adjusting mechanism
  • Probe contacting system having plane adjusting mechanism
  • Probe contacting system having plane adjusting mechanism

Examples

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Embodiment Construction

[0034] An example of a contact structure used in the probe contact system of the present invention will be described below with reference to FIGS. 3 and 4 . Many other different contact configurations are equally suitable for the probe contact system of the present invention. The contact structure 10 in FIG. 3 has bundle-like (silicon finger) contacts 30, which are fabricated using a semiconductor manufacturing process. The contact structure 10 essentially consists of a contact substrate 20 and silicon finger contacts 30 . The contact structure 10 is just placed on the contact target, such as the contact pad 320 on the semiconductor wafer 300 to be tested, so that when the two are pressed against each other, the contactor 30 establishes an electrical connection with the semiconductor wafer 300 . Although only two contactors 30 are shown in FIG. 3, in practical applications, for example, in the testing of semiconductor wafers, hundreds to thousands of contactors 30 will be ins...

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Abstract

A probe contact system is capable of adjusting distances between tips of the contactors and contact targets with simple and low cost mechanism. The planarity adjustment mechanism includes a contact substrate having a large number of contactors mounted on a surface thereof, a probe card for fixedly mounting the contact substrate and for establishing electrical communication between the contactors and a semiconductor test system, a probe card ring provided on a frame of the probe contact system for mounting the probe card, and a plurality of shims provided between the probe card and the probe card ring wherein a number of shims is adjusted so that distances between tips of the contactors and surfaces of the contact targets become identical to one another.

Description

technical field [0001] The present invention relates to a semiconductor testing system having a large number of contactors for establishing electrical connection with a semiconductor device under test, more particularly, the present invention relates to a probe contact system having a planar A planarity adjustment mechanism for adjusting the gap between the contacts of the contactor and a contact target such as a contact pad of a semiconductor wafer under test. Background technique [0002] When inspecting high-density and high-speed electronic devices, such as LSI and VLSI, it is necessary to use a high-performance contact structure assembled on a probe board. The contact structure essentially consists of a contact substrate with a plurality of contactor or probe elements. The contact substrate is mounted on a probe board for detecting burn-in of large-scale integrated circuits and ultra-large-scale integrated circuits chips, semiconductor wafers, and semiconductor wafers ...

Claims

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Application Information

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IPC IPC(8): G01R1/073G01R31/26G01R1/06G01R1/067G01R31/28H01L21/66
CPCG01R1/06794G01R1/07342G01R1/07378
Inventor西奥多·A·库利罗伯特·爱德华·阿尔达斯
Owner株式会社鼎新