Device and method processing substrate

A technology for a substrate processing device and a substrate processing method, which is applied in the directions of cleaning methods and utensils, chemical instruments and methods, and cleaning methods using liquids, etc. equality issues

Inactive Publication Date: 2006-08-02
DAINIPPON SCREEN MTG CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, problems such as uneven cleaning and uneven processing will occur.
[0004] In addition, there is such a problem: For example, in the manufacture of LCD, the metal film used for liquid crystal graphics is formed by metal materials with soft physical properties such as aluminum (Al)+molybdenum (Mo), due to the ice particles and the surface of the substrate Due to uneven impact energy, the metal film will be partially damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method processing substrate
  • Device and method processing substrate
  • Device and method processing substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0037] figure 1 An example of an embodiment of the present invention is schematically shown, and is a perspective view of a schematic configuration of a substrate processing apparatus, in this example, a substrate cleaning apparatus.

[0038] This substrate cleaning apparatus has a cleaning tank 10 formed of a sealed rectangular housing in which the substrate W is cleaned. The planar shape of the cleaning tank 10 is a rectangular shape having a width larger than the width of the substrate W and a length smaller than the length of the substrate W in the transfer direction. In the cleaning tank 10, a substrate carrying port 12 and a substrate carrying port 14 are provided on a pair of side faces facing each other, and a cleaning solution containing ice particles, such as pure water (hereinafter, A supply port 16 and a discharge port 18 referred to as "ice slur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
clearance rateaaaaaaaaaa
clearance rateaaaaaaaaaa
Login to view more

Abstract

The present invention provides a substrate processing method and a substrate processing device, which can perform uniform processing without causing uneven processing and without damaging the film formed on the substrate when processing a substrate using a processing liquid containing ice particles. The device has a cleaning tank (10) for storing a processing liquid containing ice fine particles, a unit for supplying the processing liquid containing ice fine particles into the cleaning tank (10), making it flow in the cleaning tank, and then discharging it from the cleaning tank, and A unit that loads the substrate (W) into the cleaning tank (10), transports it in the cleaning tank, and then unloads it from the cleaning tank. In the cleaning tank (10), the processing liquid containing ice particles flows relative to the substrate (W). , while making it in contact with the main surface of the substrate.

Description

technical field [0001] The present invention relates to cleaning of substrates such as semiconductor wafers, glass substrates for liquid crystal display (LCD), glass substrates for plasma displays (PDP), printed substrates, ceramic substrates, electronic device substrates, etc., using a treatment liquid containing ice particles A substrate processing method for processing, etc., and a substrate processing device for implementing the method. Background technique [0002] For example, cleaning of substrates in flat panel display (FPD) manufacturing equipment such as LCDs and PDPs is carried out through a series of steps: removal of organic contamination by UV irradiation with an excimer laser, scrubbing and cleaning using a roller brush. Removal of contaminants of 1 μm or more, removal of chemical solution after chemical solution cleaning by displacement cleaning, precision cleaning by 2-fluid cleaning, and finishing cleaning by final water cleaning. In addition, in recent ye...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B3/04F25C1/00G02F1/13H01L21/304
CPCH04N21/4104H04N21/42661H04N21/4621
Inventor 川根旬平竹市芳邦
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap