Manufacturing engineering of contact hole in bipolar circuit of integrated circuit

Abstract

The invention relates to a method for producing contact hole in dual-polar circuit of integrated circuit. Wherein, it comprises that (1), forming oxidize layer on the substrate with polar area; (2), light etching to form pattern; (3) etching at dry method and wet method to corrode to form contact hole; (4) depositing metal in the contact hole to form connecting line; between the steps (1) and (2), before light etching, using plasma to hit the surface of silica dioxide. The invention can avoid dry etching device, only process the oxidize layer with plasma, to improve the shape of contact hole, to reduce cost and save resource.

Description

Technical field [0001] The invention relates to the technical field of integrated circuit technology, in particular to a manufacturing technology of a contact hole in a bipolar circuit. Background technique [0002] In the process of bipolar circuits, when the size of the contact hole is larger than 3 microns, wet etching is usually used to form the contact hole, and when the size of the contact hole is smaller than 1 micron, it is necessary to use advanced dry etching equipment to solve the contact hole morphology technical bottleneck. When the size of the contact hole is between 1.5 microns and 2 microns, dry etching and wet etching need to be used in combination. It can be dry etched first and then wet etched; it can also be wet etched first and then dry etched. . [0003] The existing process steps are generally: oxidize the substrate material, apply glue on the surface of the substrate after oxidation, expose and develop the contact hole; after the photolithography pr...

AI Technical Summary

Problems solved by technology

[0005] However, general dry etching equipment such as LAM490 has low etching efficiency for the dense silicon dioxide layer 4, and it is difficult to form a satisfactory shape effect.

Therefore, the existing process methods are not suitable for chip circuit processing with small contact hole size, and the advanced dry etching equipment that can achieve the desired effect is very expensive

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