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Electronic device

a technology of electronic devices and components, applied in the direction of electrical apparatus casings/cabinets/drawers, semiconductor/solid-state device details, sustainable manufacturing/processing, etc., can solve the problems of difficult relative positioning of boards with accuracy, affecting the outside dimension of electronic devices, and labor and adjustment costs

Active Publication Date: 2018-08-07
NIHON DEMPA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent allows for easier insertion of support pillars and accurate positioning of boards, reducing manufacturing costs and providing a high-quality, low-price electronic device.

Problems solved by technology

However, in the case where there is the distal end of the support pillar that is off of a hole portion position when the boards to be bonded are positioned with one another, a position of such support pillar has to be finely adjusted, and this causes a labor and a cost of the adjustment.
However, in this case, relatively positioning the boards with accuracy is difficult, and this causes a problem that an outside dimension of the electronic device varies depending on the product.

Method used

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first embodiment

[0018]An example of an electronic device 100 according to an embodiment will be described using FIG. 1A and FIG. 1B. FIG. 1A is a plan view of the electronic device 100. FIG. 1B is a cross-sectional view taken along a line IB-IB in FIG. 1A. In FIG. 1A, a cover 50, which will be described later, is transparently illustrated. The electronic device 100 has a configuration of so-called surface mount type (Surface Mount Device: SMD) and is an oven controlled crystal oscillator (OCXO) that keeps an ambient temperature of a crystal resonator at constant. The same applies to other embodiments described later. The electronic device 100 includes an electronic device main body 1 and a second board (base plate) 20 as illustrated in FIG. 1A and FIG. 1B. The electronic device main body 1 includes a first board (base plate) 10.

[0019]The electronic device main body 1 is disposed on a +Y-side of the second board 20 and bonded to the second board 20. The electronic device main body 1 has a configurat...

first and second modification

[0046]The following describes configurations of the modifications according to the hole portion 21 of the second board 20 in the electronic device 100 of the first embodiment described above. In the following description, a component that is identical or equal to that of the above-described embodiment is indicated by the identical reference numeral, and the description thereof is omitted or simplified. FIG. 4A and FIG. 4B illustrate modifications of the configuration of the hole portion 21. FIG. 4A illustrates a hole portion 21A according to a first modification, and FIG. 4B illustrates a hole portion 21B according to a second modification.

[0047]As illustrated in FIG. 4A, the hole portion 21A according to the first modification includes the tapered surface T and a closed-bottom cylinder shaped surface T1 that further extends in the −Y-side from the end portion of the tapered surface T on the −Y-side. The closed-bottom cylinder shaped surface T1 is formed such that the distal end 43 ...

second embodiment

[0050]Subsequently, a second embodiment will be described with reference to FIG. 5. FIG. 5 is a cross-sectional view illustrating an example of an electronic device 200 according to the second embodiment. In the following description, a component that is identical or equal to that of the first embodiment is indicated by the identical reference numeral, and the description thereof is omitted or simplified. As illustrated in FIG. 5, the electronic device 200 includes the first board 10, the second board 20, the support pillars 40, and the cover 50.

[0051]The electronic device 200 according to this embodiment has a configuration different from the above-described electronic device 100 in the point that the electronic device 200 does not include the third board 30. In the electronic device 200, the first board 10 is held separated from the second board 20 with the support pillars 40 raised from the front surface 20a of the second board 20. The bonding surface 53a of the cover 50 is bonde...

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PUM

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Abstract

An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based on and claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. 2016-114737, filed on Jun. 8, 2016, the entire content of which is incorporated herein by reference.TECHNICAL FIELD[0002]This disclosure relates to an electronic device.DESCRIPTION OF THE RELATED ART[0003]Electronic equipment used for computers, mobile terminals, and base stations includes many electronic devices. As the electronic device, there are known a crystal unit and an oscillator that include a piezoelectric vibrating piece, such as a quartz crystal piece. As such an electronic device, there is known a configuration in which electronic components are mounted on an electronic circuit board, and the electronic circuit board is held separated from a base board with support pillars that are raised from the base board (see Japanese Unexamined Patent Application Publication No. 2008-85744, for example). In the electronic device havi...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K7/00H01L23/522H01L23/00H01L27/092H01L29/10H05K5/00H01L21/8238
CPCH01L21/823807H01L21/823842H01L29/1054H01L24/06H01L27/092H01L23/5227H01L23/481H01L23/49827H05K1/111H05K3/3421H05K3/3447H05K2201/09154H05K2201/09472H05K2201/096H05K2201/09827H05K2201/09854H05K2201/10787H05K2201/10856H05K2201/10871Y02P70/50
Inventor ARAI, JUNICHINISHIWAKI, MASAKAZUNAGATA, DAISAKU
Owner NIHON DEMPA KOGYO CO LTD
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