Method for producing a printed circuit board-cooling body structure
a cooling body and printed circuit board technology, applied in the direction of electrical apparatus construction details, transportation and packaging, lighting and heating apparatus, etc., can solve the problems of inability to dissipate flexible cooling bodies, reduce the heat dissipation effect of electronic components on printed circuit boards, and not suitable for applications, so as to simplify the handling of several base plates and reduce the number of heat transfers. , the effect of reducing the number of heat transfers
Active Publication Date: 2022-02-01
HELLA KG HUECK & CO
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- Description
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AI Technical Summary
Benefits of technology
This approach allows for efficient cooling of electronic components by directly attaching cooling rib bodies to the base plate, reducing heat transfer barriers and improving heat dissipation in vehicle lighting applications.
Problems solved by technology
However, the transfer from the printed circuit board to the contact side of the cooling body also results in a heat transfer barrier, which also reduces the effect of the heat dissipation of the electronic components on the printed circuit board.
Such a structure is, however, not suitable for applications in lighting devices of vehicles, since light-emitting diodes are used in a lighting device, which develop significantly more heat, which such a flexible cooling body is not capable of dissipating.
Method used
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Embodiment Construction
[0027]FIG. 1 shows a perspective view of a panel 5, which receives six base plates 10, for example. The base plates 10 serve as a base plate for a cooling body and at the same time as a carrier substrate of a printed circuit board for the application of a corresponding structure on a carrier side 11, which is shown pointing upwards.
[0028]FIG. 2 shows a cross-sectional view according to the cross-sectional profile A-A, as shown in FIG. 1. The base plate 10 has a carrier side 11, to which an insulation layer 12 and a solder resist 13 are applied. On the carrier side 11 there are also conductor tracks 23 which rest on the insulation layer 12 when the solder resist 13 is removed.
[0029]FIG. 3 shows a further perspective view of the plurality of base plates 10 in the composite of a panel 5, wherein rivet areas 18 have been generated laterally to the arrangement of the electronic components 14 on the support side 11. The rivet areas 18 were produced by deep milling the carrier side 11, as ...
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The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and / or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.
Description
[0001]This nonprovisional application is a continuation of International Application No. PCT / EP2018 / 083417, which was filed on Dec. 4, 2018, and which claims priority to German Patent Application No. 10 2017 129 311.6, which was filed in German on Dec. 8, 2017, and which are both herein incorporated by reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a method for producing a printed circuit board—cooling body structure, as well as such a printed circuit board—cooling body structure, in particular for arranging in a lighting device of a vehicle, in particular for a headlight of a vehicle.Description of the Background Art[0003]For example, DE 10 2010 016 534 B4, which corresponds to U.S. Pat. No. 8,348,460, discloses a printed circuit board—cooling body structure, wherein a light-emitting diode is applied to the circuit board which is to be cooled by means of the cooling body. The circuit board that carries the light-emitting diode is a...
Claims
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IPC IPC(8): H05K3/00H05K1/02F21S45/49F21S45/47H05K3/30H05K3/46
CPCH05K1/0203F21S45/47F21S45/49H05K3/0044H05K3/303H05K3/4644H05K2201/066H05K1/0204H05K1/05H05K3/0061H05K3/0097H05K2201/0382H05K2201/09054H05K2201/10106H05K2201/10598H05K2201/2072F21V29/70F21S41/192H05K7/20854
InventorBOESCH, DIRKBRINKMEIER, FRANKGOESLING, MARKUSKOERDT, CHRISTIANKOESTERS, WERNERMUENZNER, FRANKNORDHOFF, SEBASTIANSCHLUETER, MARCWIESE, THOMAS
OwnerHELLA KG HUECK & CO