Materials for chemical mechanical polishing

Inactive Publication Date: 2006-11-02
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] In another embodiment, a processing article for removing material from a substrate or semiconductor wafer comprises a plurality of tiles made of a polishing material which define a plurality of grooves therebetween. Each of the plura

Problems solved by technology

CMP has advanced over the years and is essentially limited to two types of systems that differ in the type polishing media mounted to the platen assembly that contacts the feature side of the substrate.
Although this thickness and relative hardness typically results in a longer usable life of the pad, the pad is eventually spent.
Replacement is time consuming since the pad must be peeled off the platen, the platen must be cleaned before a new pad is installed, and requalification of the tool is required.

Method used

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  • Materials for chemical mechanical polishing
  • Materials for chemical mechanical polishing
  • Materials for chemical mechanical polishing

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0025]FIG. 1 depicts a plan view of a polishing module 106 which is a portion of a REFLEXION® Chemical Mechanical Polisher, manufactured by Applied Materials, Inc., located in Santa Clara, Calif. Embodiments described herein may be used on this polishing system. However, one skilled in the art may advantageously adapt embodiments as taught and described herein to be employed on other chemical mechanical polishers that utilize polishing material, and particularly polishing material in a roll format.

[0026] The module 100 generally comprises a loading robot 104, a controller 108, a transfer station 136, a plurality of processing or polishing stations, such as platen assemblies 132, a base 140 and a carousel 134 that supports a plurality of polishing or carrier heads 152. Generally, the loading robot 104 is disposed proximate the module 100 and a factory interface 102 (not shown) to facilitate the transfer of substrates 122 therebetween.

[0027] The transfer station 136 generally includ...

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PUM

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Abstract

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] Embodiments of the invention generally relate to an apparatus and method for chemical mechanical polishing of substrates or wafers, more particularly, to a polishing article and a method of manufacture of a polishing article for chemical mechanical polishing. [0003] 2. Description of the Related Art [0004] In the fabrication of integrated circuits and other electronic devices on substrates, multiple layers of conductive, semiconductive, and dielectric materials are deposited on or removed from a feature side of a substrate. The sequential deposition and removal of these materials on the substrate may cause the feature side to become non-planar and require a planarization process, generally referred to as polishing, where previously deposited material is removed from the feature side of a substrate to form a generally even, planar or level surface. The process is useful in removing undesired surface topography and su...

Claims

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Application Information

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IPC IPC(8): B24D11/00
CPCB24D11/00B24B7/228B24D2203/00
InventorBONNER, BENJAMIN A.MCREYNOLDS, PETERMENK, GREGORY E.IYER, ANAND N.PRABHU, GOPALAKRISHNA B.RONDUM, ERIK S.JACKSON, ROBERT L.LEUNG, GARLEN
OwnerAPPLIED MATERIALS INC