Interposers with alignment fences and semiconductor device assemblies including the interposers
a technology of alignment fences and semiconductor devices, applied in the direction of electrical apparatus construction details, instruments, measurement instrument housings, etc., can solve the problems of electrical shorts between adjacent bond wires, significant number of semiconductor devices to fail, and penetration of particulate die coats, so as to facilitate some movement of semiconductor devices
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The Interposer
[0049]FIGS. 1, 1A, 1B, and 2 depict an exemplary interposer 100 of the present invention. Interposer 100 includes an interposer substrate 110 with contact pads 102 on a top surface 104 thereof and contact pads 106 on a bottom surface 108 thereof. Contact pads 102 may be recessed relative to top surface 104, as illustrated in FIG. 2. Contact pads 102 on top surface 104 of interposer substrate 110 communicate with corresponding contact pads 106 on bottom surface 108 by way of vias 118 filled or lined with metal 148 or another conductive material. Conductive structures 142, such as balls, bumps, or conductive pillars, of a conductive material, such as a solder, a metal, a metal alloy, a conductor-filled epoxy, a conductive epoxy, or a conductive (e.g., z-axis) elastomer, are secured to and protrude from contact pads 106 and from interposer 100.
[0050] Interposer substrate 110 may be fabricated from any suitable material for use in semiconductor device applications, such ...
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