Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array

a technology of photoelectric elements and substrates, applied in the field of components of radiation detectors, radiation detectors, radiation detection apparatus, can solve the problems of reducing mechanical strength, reducing the sensitivity of x-ray receiving detectors, and reducing the contact area of b>1/b>, so as to achieve the effect of convenient manufactur

Inactive Publication Date: 2007-04-19
NIHON KESSHO KOGAKU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution maximizes the effective X-ray receiving area and improves detection efficiency by maintaining a high percentage of the photodiode area and simplifying manufacturing, while reducing the risk of wiring breakage and increasing yield.

Problems solved by technology

As a result, an area occupied by the photodiodes relative to the entire radiation detector becomes small and the X-ray receiving sensitivity of the detector disadvantageously deteriorates.
To manufacture such a radiation detector as the conventional art 1, therefore, it is disadvantageously necessary to newly provide a mounting device which fixes the one-dimensional photodiode arrays onto the substrate 101 or to use a special positioning tool.
Moreover, since the conventional art 1 has a structure in which the two-dimensional scintillator arrays are directly arranged on the plural one-dimensional photodiode arrays 102, the conventional art 1 has disadvantages of a small contact area and lowered mechanical strength.
For that reason, if even one defective photodiode exists among the photodiodes which constitute the two-dimensional photodiode array, the radiation detector cannot be formed, with the result that the other photodiodes mounted on the semiconductor substrate must be abandoned.
A redundant circuit as employed in a DRAM cannot be, therefore, used and yield is disadvantageously quite low with the structure of the conventional art 2.
However, if the wirings are narrower, electrical resistance disadvantageously increases and the probability of breaking the wirings disadvantageously increases.
It is noted that some of these disadvantages explained above are not limited to the multi-slice radiation detector but seen in a single-slice radiation detector.
If one-dimensional photodiode arrays are arranged on a substrate, for example, the difference in height between pads and photodiodes is disadvantageously generated.
Moreover, these disadvantages occur not only to the radiation detector but also ordinary photo-detectors.
However, because of the same disadvantages as those explained above, there is no avoiding narrowing the light receiving area.

Method used

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  • Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
  • Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
  • Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array

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Experimental program
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Effect test

first embodiment

[0055] As shown in FIGS. 1 to 3, the component of a radiation detector in the first embodiment includes the MID substrate 1 which is three-dimensionally formed and on which three-dimensional wirings are provided, and the photodiode array 2 which is provided in contact with the MID substrate 1. A pad formation protrusion 3 is provided on the upper surface of the MID substrate 1 which surface contacts with the lower surface of the photodiode array 2. The upper end surface of this pad formation protrusion 3 is set to be equal or substantially equal in height to the upper surface of the photodiode array 2. Although not shown in FIGS. 1 to 3, a groove or a protrusion used to position the photodiode array 2 may be provided on the upper surface of the MID substrate 1. If such a positioning groove or protrusion is provided, it is unnecessary to employ a special positioning tool which arranges the photodiode array 2 on the MID substrate 1 in the manufacturing of the component of a radiation ...

third embodiment

[0070] Concrete examples of the third embodiment will be explained below. As each photodiode 2 shown in FIG. 1, a PIN type silicon photodiode having a length of 13.6 mm, a width of 1.35 mm and a thickness of 0.3 mm is used. The MID substrate 1 shown in FIG. 1 is made of liquid crystal polymer manufactured by Polyplastics Co., Ltd. The MID substrate 1 has an entire length of 13.6 mm, a thickness of 1.5 mm and a width of is 1.5 mm. The protrusion has a length of 13.6 mm, a height of 0.3 mm and a width of 0.14 mm. Each pin-like output terminal has a diameter of 0.46 mm. The wirings in a wire bonding pad section, a vertical wiring section and a through hole section are all copper-plated, nickel-plated or gold-plated. As each scintillator shown in FIG. 4, a scintillator made of CdWO4 and having a length of 13.6 mm, a width of 1.5 mm and a thickness of 2 mm are used.

[0071] The photodiodes and the MID substrate 1 are assembled together to thereby manufacture the component of a radiation de...

fourth embodiment

[0074] In the fourth embodiment, the photodiode array 22 is not located downstream of the scintillator array 21 in the light receiving direction but arranged on one side surface of the scintillator array 21 in the array aligned direction of the scintillator array 21. However, each photodiode 22a included in the photodiode array 22 does not directly converts an X-ray into an electrical signal. Specifically, each photodiode 22a receives a visible light beam dispersed radially from an atom constituting each scintillator 23 due to the incidence of X-rays on the scintillator array 21. Therefore, even if the photodiode 22a is not located on the downstream side in the light receiving direction with respect to X-ray, the photodiode 22a can surely receive the visible light beam.

[0075] As can be seen, by arranging the photodiode array 22 on one side surface of the scintillator array 21 in the array aligned direction, the following advantages are obtained. The thickness of the photodiode array...

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Abstract

In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Description

[0001] This application is a divisional application of U.S. application Ser. No. 10 / 893,906 filed Jul. 20, 2004, which is a divisional of application of U.S. application Ser No. 10 / 109,871 filed Apr. 1, 2002, which claims benefit of and priority to Japanese Patent Application Nos. 2001-112715 filed Apr. 11, 2001, 2001-196596 file Jun. 28, 2001 and 2002-016677 filed Jan. 25, 2002, which are incorporated herein by reference in their entireties for all purposes.FIELD OF THE INVENTION [0002] The present invention relates to a component of a radiation detector, a radiation detector, and radiation detection apparatus. BACKGROUND OF THE INVENTION [0003] An X-ray CT system used in a medical institution or the like photographs the internal structure of a subject by applying an X-ray to the subject. Specifically, the x-ray CT system includes an X-ray irradiation source and a radiation detector which is arranged to be opposed to the X-ray irradiation source through a subject and which has an X...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L33/00H01L31/12H01L27/15H01L29/26G01T1/20G01T1/24H01L21/60H01L27/14H01L31/09H04N25/00
CPCG01T1/2018H01L27/14661H01L27/14663H01L2224/48227H01L2924/01078H01L2924/01079H01L2924/09701H01L2924/12032G01T1/20183H01L2924/00
InventorSEKINE, SHIGENORIYANADA, TOSHIKAZU
OwnerNIHON KESSHO KOGAKU