Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
a technology of photoelectric elements and substrates, applied in the field of components of radiation detectors, radiation detectors, radiation detection apparatus, can solve the problems of reducing mechanical strength, reducing the sensitivity of x-ray receiving detectors, and reducing the contact area of b>1/b>, so as to achieve the effect of convenient manufactur
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first embodiment
[0055] As shown in FIGS. 1 to 3, the component of a radiation detector in the first embodiment includes the MID substrate 1 which is three-dimensionally formed and on which three-dimensional wirings are provided, and the photodiode array 2 which is provided in contact with the MID substrate 1. A pad formation protrusion 3 is provided on the upper surface of the MID substrate 1 which surface contacts with the lower surface of the photodiode array 2. The upper end surface of this pad formation protrusion 3 is set to be equal or substantially equal in height to the upper surface of the photodiode array 2. Although not shown in FIGS. 1 to 3, a groove or a protrusion used to position the photodiode array 2 may be provided on the upper surface of the MID substrate 1. If such a positioning groove or protrusion is provided, it is unnecessary to employ a special positioning tool which arranges the photodiode array 2 on the MID substrate 1 in the manufacturing of the component of a radiation ...
third embodiment
[0070] Concrete examples of the third embodiment will be explained below. As each photodiode 2 shown in FIG. 1, a PIN type silicon photodiode having a length of 13.6 mm, a width of 1.35 mm and a thickness of 0.3 mm is used. The MID substrate 1 shown in FIG. 1 is made of liquid crystal polymer manufactured by Polyplastics Co., Ltd. The MID substrate 1 has an entire length of 13.6 mm, a thickness of 1.5 mm and a width of is 1.5 mm. The protrusion has a length of 13.6 mm, a height of 0.3 mm and a width of 0.14 mm. Each pin-like output terminal has a diameter of 0.46 mm. The wirings in a wire bonding pad section, a vertical wiring section and a through hole section are all copper-plated, nickel-plated or gold-plated. As each scintillator shown in FIG. 4, a scintillator made of CdWO4 and having a length of 13.6 mm, a width of 1.5 mm and a thickness of 2 mm are used.
[0071] The photodiodes and the MID substrate 1 are assembled together to thereby manufacture the component of a radiation de...
fourth embodiment
[0074] In the fourth embodiment, the photodiode array 22 is not located downstream of the scintillator array 21 in the light receiving direction but arranged on one side surface of the scintillator array 21 in the array aligned direction of the scintillator array 21. However, each photodiode 22a included in the photodiode array 22 does not directly converts an X-ray into an electrical signal. Specifically, each photodiode 22a receives a visible light beam dispersed radially from an atom constituting each scintillator 23 due to the incidence of X-rays on the scintillator array 21. Therefore, even if the photodiode 22a is not located on the downstream side in the light receiving direction with respect to X-ray, the photodiode 22a can surely receive the visible light beam.
[0075] As can be seen, by arranging the photodiode array 22 on one side surface of the scintillator array 21 in the array aligned direction, the following advantages are obtained. The thickness of the photodiode array...
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