Transparent substrate heat dissipater
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[0012] The present invention includes a substrate 100. Preferably, the substrate is substantially transparent, for example, glass, quartz or the like. At least one Peltier diode 110 is formed on the substrate, as shown in FIGS. 1A and 1B. The Peltier diode 110 includes a first electrode 112 and a second electrode 114, n-type and p-type semiconductors 116, 118 connected to each other at two junctions (Peltier junctions). The n-type and p-type semiconductors 116, 118 can be silicon layer or other III-V elements. The pattern can be formed by etching printing, or coating, as well known in the art. The conductive lines 120, 122 are coupled to the first electrode 112 and a second electrode 114, respectively. A heat difference is created between the two junctions. The current drives a heat transfer from one junction to the other, one junction cools off while the other heats up. Therefore, the heat may transfer from one side to another. An isolation material 124 may be filled between the fi...
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