A temperature-resistant epoxy glue for casting micro/ultrafiltration membrane components

Abstract

The invention discloses temperature-resistant epoxy glue for micro / ultra-filtration membrane module pouring and belongs to the technical field of epoxy adhesives. The temperature-resistant epoxy glue comprises a resin component and a curing agent component. A preparation technology includes mixing and stirring basic epoxy resin, modified epoxy resin and a defoaming agent uniformly to obtain the resin component; subjecting an aromatic amine curing agent and phenyl glycidyl ether to pre-reaction according to a specific ratio for 30-60 minutes at 60-80 DEG C, mixing a reactant with a polyether amine curing agent with stirring evenly and decreasing the temperature to the room temperature so as to obtain the curing agent component; mixing and stirring the resin component and the curing agent component according to a weight ratio of 100 to (70-85), standing, defoaming and curing at the room temperature. The temperature-resistant epoxy glue has the advantages of room-temperature curing, moderate mixing viscosity, gentle reaction heat release, high adhesive strength and high temperature tolerance and is applicable to micro / ultra-filtration membrane module pouring in the field of high-temperature separation.

Description

Technical field

[0001] The invention relates to a temperature-resistant epoxy adhesive used for pouring micro / ultrafiltration membrane components, which is suitable for the technical field of epoxy adhesives. Background technique

[0002] Micro / ultrafiltration membrane water purification is a new technology with both environmental protection and energy saving. It has high treatment efficiency, good effect and low energy consumption. It is widely used in drinking water treatment, seawater desalination, sewage reuse, industrial wastewater treatment and other fields.

[0003] The micro / ultrafiltration membrane module is the core component of the micro / ultrafiltration membrane application, usually using polyurethane glue or epoxy resin glue for casting and sealing. The epoxy resin glue used for conventional micro / ultrafiltration membrane module pouring is limited by technical conditions, and generally can only be used in a temperature environment within 45℃. At present, high-temperatur...

Examples

Embodiment 1

[0019] Mix 40 parts of basic epoxy resin E-51, 60 parts of modified epoxy resin TDE-85, and 0.3 parts of defoaming agent with a weight ratio of 40 parts, and defoam them as the resin component; add 10 parts of isobenzene The dimethylamine condensate was reacted with 15 parts of benzyl glycidyl ether at 60° C. for 60 minutes, and then 50 parts of T403 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, after mixing the resin component and the curing agent component according to 100:75, stir evenly, and then let it stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mix viscosity 1780mpa.s; pot life ≥3h; 100g curing exothermic peak 56℃; ABS-ABS substrate lap shear strength 6.17Mpa; DSC method test Tg 97.1℃.

Embodiment 2

[0021] Mix 55 parts of basic epoxy resin E-51, 45 parts of modified epoxy resin AG-80, and 0.5 parts of defoaming agent with a weight ratio of 55 parts. Diamine and 25 parts of benzyl glycidyl ether were reacted at 80°C for 30 minutes, and then 20 parts of D230 and 30 parts of D400 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, the resin component and the curing agent component are mixed and stirred evenly according to 100:85, and then stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mixed viscosity 1830mpa.s; pot life ≥3h; 100g curing exothermic peak 49℃; ABS-ABS substrate lap shear strength 5.89Mpa; DSC method test Tg 91.8℃.

Embodiment 3

[0023] Mix 70 parts of basic epoxy resin E-51, 30 parts of modified epoxy resin AG-80 and 0.4 parts of defoaming agent with a weight ratio of 70 parts, and then defoam them as the resin component; add 10 parts of isobenzene Dimethylamine and 18 parts of phenyl glycidyl ether were reacted at 70°C for 45 minutes, then 32 parts of T403 and 10 parts of D230 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, the resin component and the curing agent component are mixed and stirred evenly according to 100:70, and then stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mix viscosity 1940mpa.s; pot life ≥3h; 100g curing exothermic peak 53℃; ABS-ABS substrate lap shear strength 6.05Mpa; DSC method test Tg 95.2℃.

Technical field

[0001] The invention relates to a temperature-resistant epoxy adhesive used for pouring micro / ultrafiltration membrane components, which is suitable for the technical field of epoxy adhesives. Background technique

[0002] Micro / ultrafiltration membrane water purification is a new technology with both environmental protection and energy saving. It has high treatment efficiency, good effect and low energy consumption. It is widely used in drinking water treatment, seawater desalination, sewage reuse, industrial wastewater treatment and other fields.

[0003] The micro / ultrafiltration membrane module is the core component of the micro / ultrafiltration membrane application, usually using polyurethane glue or epoxy resin glue for casting and sealing. The epoxy resin glue used for conventional micro / ultrafiltration membrane module pouring is limited by technical conditions, and generally can only be used in a temperature environment within 45℃. At present, high-temperatur...

Examples

Embodiment 1

[0019] Mix 40 parts of basic epoxy resin E-51, 60 parts of modified epoxy resin TDE-85, and 0.3 parts of defoaming agent with a weight ratio of 40 parts, and defoam them as the resin component; add 10 parts of isobenzene The dimethylamine condensate was reacted with 15 parts of benzyl glycidyl ether at 60° C. for 60 minutes, and then 50 parts of T403 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, after mixing the resin component and the curing agent component according to 100:75, stir evenly, and then let it stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mix viscosity 1780mpa.s; pot life ≥3h; 100g curing exothermic peak 56℃; ABS-ABS substrate lap shear strength 6.17Mpa; DSC method test Tg 97.1℃.

Embodiment 2

[0021] Mix 55 parts of basic epoxy resin E-51, 45 parts of modified epoxy resin AG-80, and 0.5 parts of defoaming agent with a weight ratio of 55 parts. Diamine and 25 parts of benzyl glycidyl ether were reacted at 80°C for 30 minutes, and then 20 parts of D230 and 30 parts of D400 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, the resin component and the curing agent component are mixed and stirred evenly according to 100:85, and then stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mixed viscosity 1830mpa.s; pot life ≥3h; 100g curing exothermic peak 49℃; ABS-ABS substrate lap shear strength 5.89Mpa; DSC method test Tg 91.8℃.

Embodiment 3

[0023] Mix 70 parts of basic epoxy resin E-51, 30 parts of modified epoxy resin AG-80 and 0.4 parts of defoaming agent with a weight ratio of 70 parts, and then defoam them as the resin component; add 10 parts of isobenzene Dimethylamine and 18 parts of phenyl glycidyl ether were reacted at 70°C for 45 minutes, then 32 parts of T403 and 10 parts of D230 were added, mixed and stirred uniformly, defoamed, and cooled to room temperature as the curing agent component. When in use, the resin component and the curing agent component are mixed and stirred evenly according to 100:70, and then stand for 5 minutes to defoam to obtain the epoxy glue liquid. Mix viscosity 1940mpa.s; pot life ≥3h; 100g curing exothermic peak 53℃; ABS-ABS substrate lap shear strength 6.05Mpa; DSC method test Tg 95.2℃.