The application discloses a
single crystal silicon wafer processing clamp, and relates to the technical field of
single crystal silicon processing, which comprises a mounting ring, a driving gear ring, a primary clamp
assembly, a guide, a secondary clamp
assembly and a driving unit. The mounting ring serves as a bearing base, the top of the mounting ring is provided with the driving gear ring, the inner ring is provided with the primary clamp
assembly, the outer wall is fixedly connected with the guide, the guide is internally provided with the secondary clamp assembly, and the driving unit is internally provided with a built-in driving unit which is connected with the two-stage clamp through the mounting ring. For different thicknesses of
silicon wafers, thin silicon wafers are clamped by the silicon
wafer clamping plate through the driving motor one and the driving gear ring and the inclined push head; thick silicon wafers are clamped by the silicon
wafer clamping arm after being centered by the driving motor two and the driving ring and the centering arm, and are clamped by the silicon wafer clamping arm. The clamp integrates the grading clamping and the precise guide structure, has the protection design, is high in adaptability, accurate in clamping, can avoid damage to the silicon wafer, is suitable for
automatic processing, and improves the
processing efficiency and the qualified rate.