Phenolic resin additive, phenolic resin with the additive and its preparation process

A phenolic resin and additive technology, which is applied in the field of phenolic resin additives for wood-based panels and their preparation, can solve the problems of affecting the curing performance and bonding strength of adhesives, underutilization of fenugreek, and high prices, and achieves the Effects of a reduction in the phenolic resin content, a reduction in the amount of resin, and a reduction in manufacturing costs

Inactive Publication Date: 2009-07-22
BEIJING FORESTRY UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of general protein is high, and the curing performance and bonding strength of the adhesive are often affected when the amount added is too much, which limits its use.
At present, there is a kind of fenugreek rich in protein and polysaccharide that has not been fully utilized, and its utilization is limited to medicinal and biological glue, and its utilization rate is about 30%, and about 70% of the remaining residues are discarded and have not been effectively used

Method used

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  • Phenolic resin additive, phenolic resin with the additive and its preparation process
  • Phenolic resin additive, phenolic resin with the additive and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1) Prepare a sodium carbonate solution with a concentration of 5%. Add 25kg of fenugreek residue powder to 75kg of sodium carbonate solution, stir and heat to 70-80°C, react for 3-6 hours, cool to 30°C, and obtain a viscosity of 200 -400cP homogeneous fenugreek residue mucilage.

[0015] 2) Mix the obtained fenugreek residue mucus with an alkaline water-soluble phenolic resin with a molar ratio of phenol and formaldehyde of 1:2.1 in a ratio of 30:70 by weight to prepare a phenolic resin adhesive.

[0016] Among them, the performance index of fenugreek residue mucus is as follows:

[0017] Appearance: yellow-brown mucus

[0018] pH: 9-11

[0019] Solid content: 25-30%

[0020] The quality indicators of the adhesive are as follows:

[0021] Solid content 30-40%

[0022] pH 10.0-11.0

[0023] Viscosity (20℃) 150-300mPa·s

[0024] Free formaldehyde content <0.2%

[0025] Free phenol content <0.2%

[0026] Storage period 2-3 months

[0027] The phenolic resin molar...

Embodiment 2

[0042] 1) Prepare a sodium carbonate solution with a concentration of 5%, add 25kg of fenugreek residue powder to 75kg of the solution, stir and heat to 70-80°C, react for 3-6 hours, cool down to 30°C, and obtain a solution with a viscosity of 200-400cP Evenly fenugreek residue mucilage.

[0043] 2) The obtained fenugreek residue mucus and the same alkaline water-soluble phenolic resin as in Example 1 were uniformly mixed in a ratio of 50:50 by weight to make a phenolic resin adhesive.

[0044] The adhesive quality index:

[0045] Solid content 30-40%

[0046] pH 9.5-10.5

[0047] Viscosity (20℃) 150-300mPa·s

[0048] Free formaldehyde content <0.2%

[0049] Free phenol content <0.2%

[0050] Storage period 60-90 days

experiment example

[0063] Utilize the phenolic resin binder prepared by the phenolic resin of the embodiment of the present invention 1,2 method and comparative example 1 and comparative example 2 method respectively to manufacture seven-layer plywood, adopt following preparation process parameters:

[0064] Veneer: Poplar, thickness 1.6mm;

[0065] Glue adjustment: each glue type is added with flour according to 10% of the total weight, and mixed evenly;

[0066] Glue sizing: gluing on the core board, the amount of gluing is 220~300g / m 2 ;

[0067] Aging: 10-30 minutes;

[0068]Hot pressing: 130°C, 1.5MPa, 70s / mm.

[0069] The performance test results of the seven-layer plywood manufactured by the above process are shown in Table 1, and the bonding strength was measured according to the provisions of GB / T17657-1999 "Test Methods for Physical and Chemical Properties of Wood-based Panels and Decorated Wood-based Panels".

[0070] Table 1 Formaldehyde emission and bonding strength of glued ply...

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Abstract

The invention discloses an additive for a phenolic resin adhesive for an artificial board and a preparation method thereof. After uniformly mixing 70-80 parts by weight of 3-25% sodium carbonate solution and 20-30 parts by weight of fenugreek residue powder, heating to 70°C-80°C for 3-6 hours, and then cooling to 30°C, the prepared Viscosity is the uniform fenugreek residue mucus of 200-400mPa·s, and this mucus can be used as the additive of phenolic resin; After the basic water-soluble phenolic resin and this fenugreek residue mucus are mixed uniformly in a weight ratio of 90-50:10-50, it can be A phenolic resin adhesive was prepared. The present invention can make full use of all fenugreek residues, and compared with ordinary phenolic resin adhesives, the manufacturing cost is reduced by 8-40%, and can ensure that the bonding strength of phenolic resin adhesives meets the national standard; in addition, due to the present invention The content of the phenolic resin in the phenolic resin binder of the invention is reduced, and the fenugreek protein contains groups such as amino groups that can react with formaldehyde, thus reducing the amount of formaldehyde released.

Description

technical field [0001] The invention relates to an additive for an adhesive, an adhesive based on an organic polymer compound containing the additive and a preparation method thereof, in particular to an additive for a phenolic resin for a wood-based panel and a preparation method thereof. Background technique [0002] With the rapid development of construction, decoration, packaging and other industries, the output of wood-based panels in my country has increased rapidly, and the adhesives for wood-based panels have also developed rapidly. The types of adhesives used for wood-based panels in my country are roughly the same as those in foreign countries. The commonly used "trialdehyde adhesives" include urea-formaldehyde resins, phenolic resins and melamine-formaldehyde resin adhesives, which occupy a dominant position. Among them, phenolic resin is an excellent and widely used glue type in wood adhesives, and phenolic resin is the preferred adhesive in the production of wea...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C08K11/00C08L61/06
Inventor李建章周文瑞任强赵金平王建中陈欣赵强母军
OwnerBEIJING FORESTRY UNIVERSITY