36results about How to "Does not reduce bond strength" patented technology

An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comprises a polymerizable acrylic compound, a film-forming resin, a polymerization initiator and conductive particles, wherein the insulating adhesive layer and the conductive-particle -containing layer each contain a thiol compound in order to further improve the reliability of connection without lowering the bond strength to an adherend. The thiol compound includes pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylol-propane tris(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), and so on.

The invention provides a two-layer two-sided flexibility copper clad plate and a method for preparing the same. The two-layer two-sided flexibility copper clad plate comprises two copper foil layers and a thermoplastic polyimide layer between the two copper foil layers. The thermoplastic polyimide layer is prepared by dissolving aromatic diamine and aromatic diandhydrides in a ratio of 0.9:1.1 in a polarity aprotic solvent to be reacted to generate a precursor thermoplastic polyamic acid solution and imidize the precursor thermoplastic polyamic acid solution at a high temperature. The thermoplastic polyimide layer comprises organic silicon polymer fillers which have good compatibility with organic resin, and the adding amount of the organic silicon polymer fillers is 1% to 40% of the total mass of all solid reactants of polyimide resins. The coefficient of thermal expansion of the thermoplastic polyimide can be reduced apparently to be close to the thermal expansion coefficients of copper foil and non-thermoplastic polyimide by adding the organic silicon polymer fillers, accordingly, curly and warping problems of the two-layer two-sided flexibility copper clad plate in the preparation process are solved.

The invention discloses an environmentally friendly and efficient ice-melting coating material and its preparation method and application, aiming to solve the problems of high cost of deicing, environmental pollution caused by deicing agents, harm to roads and the environment, and the technology that cannot function effectively for a long time question. The coating material is made of the following raw materials: deicing agent, bonding material, hydrophobic coating material, hydrophilic coating material, hydrophobic plasticizer, hydrophilic plasticizer, glycerin, anti-sticking agent, Talc powder, filler, semi-reinforcing agent, leveling agent, coupling agent, defoamer, porogen, hydrophobic fumed silica. And further provide a preparation method of the coating material, and apply it to ice melting of traffic roads. The invention does not contain harmful ions, does not cause corrosion and does not damage the environment when deicing for a long time, and has a better maintenance effect on the road surface; the raw material has a wide range of sources, the cost is low, the production process is simple and easy to operate, and can be popularized and applied in a wide range; It reduces a lot of manpower and material resources and has important economic value.

The invention discloses an additive of phenolic resin, the preparation method and a phenolic resin adhesive for the additive. Raw materials of the additive comprise disperse medium, protein powder ofdefatted soybean, sodium carbonate and complexing agent; wherein, for the parts by weight of the raw materials is that: 70 to 80 of disperse medium, 20 to 35 of protein powder of defatted soybean, 0.5to 3 of sodium carbonate, 0.8 to 2 of complexing agent which comprises borax and aluminum sulfate with 1.5 to 12:1 of parts by weight. The additive of the invention comprises protein powder of defatted soybean. The invention has the advantages of not only lowering the manufacturing cost of the adhesive, guaranteeing bonding strength of prepared plywood, but also effectively lowering formaldehydeemission of prepared artificial board when the additive is added into the phenolic resin.

The invention discloses a tooling and a method for cleaning a CMOS image sensor circuit, belonging to the field of CMOS image sensor circuit packaging. Compared with the traditional method, the present invention can quickly and effectively remove the contamination, dust and other forms of redundant matter attached to the surface of the chip, the casing and the glass cover, and solve the problem that the photosensitive part of the CMOS image sensor circuit is damaged due to the redundant matter inside. The problem of low reliability caused by the formation of bad spots due to shading will not affect the bonding strength of the bonding wire inside the circuit. The method of the present invention can effectively remove redundant substances inside the CMOS image sensor circuit, ensure the reliability of the CMOS image sensor circuit after packaging, effectively shorten the production cycle, and the cleaning method is simple, practical, easy to realize and strong in operability.

A rare earth permanent magnet that can increase the coercive force of the magnet without reducing the remanence and energy product of the magnet, and at the same time can not reduce the bonding strength between the substrate and the coating or coating after plating or coating, and prepare the magnet The method is as follows: first, dissolve the powder containing R2 fluoride, R3 nitrate and R4 phosphate in water or alcohol to prepare a solution; arrange the above solution evenly on the surface of the magnet to be treated; then dehydrate the magnet to be treated or alcohol treatment; finally, the treated magnet is subjected to diffusion heat treatment to obtain the treated magnet. The method used in the present invention can improve the uniformity of the powder on the surface of the magnet, reduce the powder residue on the surface of the magnet after thermal diffusion, improve the coercive force of the magnet, and not reduce the bonding between the substrate and the coating or coating after plating or coating strength.

The invention discloses a preparation technology of a copper-zinc-aluminum three-layer composite conductive wire bank. The technology comprises the following steps of: (1) cleaning a copper tube; (2) galvanizing the copper tube; (3) carrying out rolling by a three-roll planetary rolling mill after an aluminum tube is inserted to obtain a copper-zinc-aluminum three-layer composite tube blank; (4) inserting an aluminum bar and drawing the copper-zinc-aluminum three-layer composite tube blank and the aluminum bar by a tube drawing machine until the copper-zinc-aluminum three-layer composite tube blank and the aluminum bar are laminated to obtain a composite rough blank; and (5) carrying out online heating on the composite rough blank through an induction coil, and directly rolling the rectangular copper-zinc-aluminum three-layer composite conductive wire bank through a two-direction rolling mill. According to the prepared composite conductive wire bank, the surface quality is good; no brittle phase is generated among three metals; the strength of the joint surface is high; the stratification phenomenon is avoided after rolling; and the used production equipment is simple, high in flexibility and low in cost.

An additive of phenolic resin, phenolic resin containing it and its production are disclosed. The procedure is carried out by mixing 3-25% sodium carbonate solution 70-80 proportion with gynesin residue powder 20-30 proportion, heating to 70-80 degrees C, reacting for 3-6hrs, lowering temperature to 30 degrees C to obtain homogeneous 200-400mPas gynesin residue mucus as additive of phenolic resin, mixing alkali soluble phenolic resin with gynesin residue powder in proportion of 90-50:10-50 and obtain the final product. It is cheap and has less formaldehyde releasing account.

A copper foil for micro wiring comprises; forming a composite metal layer on the surface to be bonded of the copper foil, by electrolyzing it in a plating bath which contains copper ion, ion of metals selected from tungsten or molybdenum, ion of metals selected from nickel, cobalt, iron, or zinc, and chloride ion of 1-100 mg / l, at an electric current density of less than limiting current density of the bath; forming a dendritic copper electrodeposited layer on the composite metal layer, by electrolyzing it in a plating bath containing copper ion, at the electric current density of more than the limiting current density of the bath; and forming coarsened layer consisting of copper, by further electrolyzing it at the current density of less than the limiting current density of the bath to form knotty copper.

The invention relates to the technical field of removing formaldehyde from boards, and discloses a composite formaldehyde scavenger comprising the following components: MOFs, modified starch, fluorinated polyether, xanthan gum, ethylene urea, epoxy fatty acid methyl ester and deionized water . The invention also provides a preparation method of the composite formaldehyde scavenger. The invention also provides a method for removing aldehydes from wood-based panels: mixing a compound formaldehyde scavenger in the adhesive; hot-pressing the veneer paper soaked in the mixed adhesive on the surface of the core board; and heat-treating the veneer wood-based panel. The invention can continuously absorb and remove the formaldehyde and VOC released from the wood-based panel, provides a formaldehyde-free wood-based panel, and avoids formaldehyde pollution and harm to users.