36results about How to "Does not reduce bond strength" patented technology

Disclosed are a rare earth permanent magnet and a preparation method. The preparation method of the rare earth permanent magnet is capable of improving coercivity of the magnet while keeping binding strength of a base body and a plated layer or coated layer after plating or coating on the basis without reducing remanence and magnetic energy product of the magnet and includes: firstly dissolving powder of fluoride containing R2, nitrate containing R3 and phosphate containing R4 into water or alcohol to prepare solution; uniformly applying the solution on the surface of a magnet to be treated; then dewatering or performing alcohol treatment on the magnet to be treated; finally, enabling the magnet to be treated to be subjected to diffusion heat treatment to obtain the treated magnet. By the aid of the preparation method, uniformity of the powder on the surface of the magnet can be improved, powder residues on the surface of the magnet after heat diffusion are reduced, the coercivity of the magnet is improved, and the binding strength of the magnet of the base body and the plated layer or coated layer after plating or coating is kept constant.

The invention provides low-temperature resistant hot melt adhesive and a processing technology of the low-temperature resistant hot melt adhesive. The low-temperature resistant hot melt adhesive comprises the following components: polyamide, an ethylene vinyl acetate copolymer, an ethylene-acrylate-maleic anhydride terpolymer, wax, tackifying resin and an antioxidant. The low-temperature resistant hot melt adhesive is high in adhesive strength, excellent in insulating seal performance, environmentally-friendly, nontoxic, simple in production technology and high in repeatability, and is mainly applicable to places requiring high low-temperature performance.

A copper foil for micro wiring comprises; forming a composite metal layer on the surface to be bonded of the copper foil, by electrolyzing it in a plating bath which contains copper ion, ion of metals selected from tungsten or molybdenum, ion of metals selected from nickel, cobalt, iron, or zinc, and chloride ion of 1-100 mg/l, at an electric current density of less than limiting current density of the bath; forming a dendritic copper electrodeposited layer on the composite metal layer, by electrolyzing it in a plating bath containing copper ion, at the electric current density of more than the limiting current density of the bath; and forming coarsened layer consisting of copper, by further electrolyzing it at the current density of less than the limiting current density of the bath to form knotty copper.

A method for manufacturing a display apparatus comprises: performing radiation processing on a polyimide film at a sealed position of a substrate, so as to make the polyimide film at the sealed position of the substrate generate a free radical; and coating frame sealing glue at the sealed position, and performing consolidation. By performing radiation processing on a polyimide film, a cracking reaction of a surface group of the polyimide film occurs to generate a free radical; mutual reactions can occur between the free radical and an active group of the frame sealing glue, so that the bonding strength is increased, and the problems such as liquid crystal puncture, liquid crystal pollution and poor reliability are avoided.

The invention provides an additive with urea formaldehyde, a preparation method and a urea formaldehyde resin adhesive. The additive is provided by the invention. The raw material of the additive is comprised of the dispersion medium, the dried egg white of the degreased bean and the complexing agent, the weight ratio of the raw material is: 70-80 of dispersion medium, 20-35 of dried egg white of the degreased bean, 1-3 of complexing agent, the complexing agent is consisted of the aluminium sulphate and the zirconium carbonate with the weight ratio of 0.4-2.4:1. The additive provided by the invention contains dried egg white of the degreased bean, and then both the bond strength of the prepared veneer is increased and the formaldehyde emission of the preparing artificial slabs is effective decreased when adding the additive into the urea formaldehyde.

The present invention relates to a method of producing a building panel (1)such as a floor panel, comprising providing a carrier (3) comprising a thermoplastic material,applying a primer comprising at least one salt, preferably a metal salt,on a first surface of the carrier (3),printing by means of digital printing a first print (10) on said first surface of the carrier (3) with an aqueous pigment ink composition, and applying a protective layer (4) on the carrier (3) and applying the carrier (3) on a core (2) comprising a thermoplastic material, and pressing by applying heat and pressure the protective layer (4), the carrier (3) and the core (2) together to form a building panel (1).The present invention also relates to a method for forming a decorative substrate.

The invention provides a two-layer two-sided flexibility copper clad plate and a method for preparing the same. The two-layer two-sided flexibility copper clad plate comprises two copper foil layers and a thermoplastic polyimide layer between the two copper foil layers. The thermoplastic polyimide layer is prepared by dissolving aromatic diamine and aromatic diandhydrides in a ratio of 0.9:1.1 in a polarity aprotic solvent to be reacted to generate a precursor thermoplastic polyamic acid solution and imidize the precursor thermoplastic polyamic acid solution at a high temperature. The thermoplastic polyimide layer comprises organic silicon polymer fillers which have good compatibility with organic resin, and the adding amount of the organic silicon polymer fillers is 1% to 40% of the total mass of all solid reactants of polyimide resins. The coefficient of thermal expansion of the thermoplastic polyimide can be reduced apparently to be close to the thermal expansion coefficients of copper foil and non-thermoplastic polyimide by adding the organic silicon polymer fillers, accordingly, curly and warping problems of the two-layer two-sided flexibility copper clad plate in the preparation process are solved.

The invention discloses an environment-friendly efficient ice-melting coating material and a preparation method and an application thereof and aims to solve the technical problem that the deicing costis high, and a deicer pollutes the environment, harms roads and the environment and cannot play roles effectively durably. The coating is prepared from the following raw materials: a deicer, a bonding material, a hydrophobic coating material, a hydrophilic coating material, a hydrophobic plasticizer, a hydrophilic plasticizer, glycerinum, an antisticking agent, talc powder, filler, a semi-fortifier, a flatting agent, a coupling reagent, a defoamer, a pore-foaming agent and hydrophobic fumed silica. The invention further provides a preparation method of the coating material. The coating material is applied to deicing traffic roads. The environment-friendly efficient ice-melting coating material is free of harmful ions, does not lead to corrosion and damage the environment during deicing durably, and has relatively good curing action to the pavement. The raw materials are wide in source, low in cost, simple in production process and easy to operate, and can be popularized and applied ona large scale. A lot of manpower and material resources are reduced, and the environment-friendly efficient ice-melting coating material has important economical value.

The invention provides an additive for phenolic resin, a preparation method thereof and a phenolic resin adhesive containing the additive. The raw materials of the additive include dispersion medium, defatted soy protein powder, sodium carbonate and complexing agent, wherein the ratio of the raw materials is: dispersing medium 70-80, defatted soy protein powder 20-35, sodium carbonate 0.5-3, complexing agent The mixture is 0.8-2, and the complexing agent includes borax and aluminum sulfate with a weight ratio of 1.5-12:1. The additive of the present invention contains defatted soybean protein powder, and adding the additive to the phenolic resin not only reduces the manufacturing cost of the adhesive, ensures the bonding strength of the prepared plywood, but also can effectively reduce the formaldehyde emission in the prepared artificial board.

The invention relates to the technical field of formaldehyde removal of boards, and discloses a composite formaldehyde catching agent which comprises the following components: MOFs, modified starch, fluorinated polyether, xanthan gum, ethylene urea, epoxy fatty acid methyl ester and deionized water. The invention also provides a preparation method of the composite formaldehyde catching agent. Theinvention further provides an artificial board formaldehyde removing method. The method comprises the steps: mixing an adhesive with the composite formaldehyde catching agent; hot-pressing veneering paper soaked with the mixed adhesive on the surface of a core plate; and carrying out heat treatment of the veneered artificial board. Formaldehyde and VOC released from the artificial board can be continuously adsorbed and removed, the formaldehyde-free artificial board is provided, and formaldehyde pollution and harm to a user are avoided.

The invention belongs to the field of polymer adhesives, and particularly relates to a hot melt adhesive for a steel plastic-lined composite pipeline and a preparation method of the hot melt adhesive.The hot melt adhesive for the steel plastic-lined composite pipeline comprises, by weight, 100 parts of matrix resin, 15-20 parts of tackifying resin, 1-3 parts of silane crosslinking agents, 0.5-1 part of compatilizers, 0.5-1.5 parts of antioxidants, 0.5-1 part of plasticizers and 20-30 parts of fillers. The hot melt adhesive for the steel plastic-lined composite pipeline is high in adhesive force, good in weather resistance and heat stability, resistant to ageing, acid and alkali, green, environmentally friendly and cannot be limited by the temperature, can be normally used at low temperature and effectively adhere metal and plastics, and the preparation method is simple, easy to operate and low in cost.

The invention discloses an environmentally friendly efficient snowmelt pavement coating material and a preparation method and applications thereof, and aims to solve the technical problems that the ice removing cost in winter is high, the environment is polluted by the snow melting agents, the roads and the environment are damaged by an ice removing technology, and the snow melting means cannot last for a long time. The coating material is made of following raw materials: a snow melting agent, a binding material, a hydrophobic coating material, a hydrophilic coating material, a hydrophobic plasticizer, a hydrophilic plasticizer, glycerin, an anti-sticking agent, talcum powder, a filling material, a semi-reinforcing agent, a leveling agent, a coupling agent, an antifoaming agent, a pore forming agent, and a hydrophobic fumed silica. The invention further provides a preparation method of the coating material, and the coating material is applied to snow melting of traffic roads. The coating material is green and environmentally, and can well protect the pavement. The raw material sources are wide, the cost is low, the production technology is simple and easy to operate and is suitablefor large scale application and popularization, a great amount of human resources and materials is saved, and a great economic value is created.

The invention discloses a tooling and a method for cleaning a CMOS image sensor circuit, and belongs to the CMOS image sensor circuit packaging field. Compared with conventional methods, that invention can quickly and effectively remove dirt, dust and other forms of excess attached on surfaces of a chip, a housing, and a glass cover plate, solves the problem of low reliability of the CMOS image sensor circuit due to the presence of excess in the circuit, which results in the failure of the photosensitive part, and does not affect the bonding strength of the bonding wires inside the circuit. The method of the invention can effectively remove the internal redundancy of the CMOS image sensor circuit, ensure the reliability of the CMOS image sensor circuit after packaging, effectively shortenthe production cycle, and the cleaning method is simple and practical, easy to realize and strong in maneuverability.

The invention discloses a UV curing adhesive for a polarizing plate, and a preparation method and application thereof. The UV curing adhesive for the polarizing plate is obtained by mixing an epoxy compound, a (meth)acrylate compound, a vinyl ether compound, a carboxylic acid compound containing unsaturated double bonds, a cationic photoinitiator and a free radical photoinitiator. The UV curing adhesive can prevent degradation of adhesiveness of the radical curable adhesive composition by maintaining a hydrogen bond between a polyvinyl alcohol (PVA) film and a hydroxyl group of the radical curable adhesive composition, thereby improving moisture resistance of the adhesive.

A badminton racket comprises an oval-shaped frame and a hollow shaft joined together by a T-joint coated with adhesive. A vertical stem of the T-joint is provided with a plurality of ribs extending axially on the external surface thereof. The ribs are formed such that, when the T-joint is inserted into an upper open end of the shaft, top edges of the ribs are brought into close contact with inner surface of the shaft.