36results about How to "Does not reduce bond strength" patented technology

The invention discloses an environmentally friendly and efficient ice-melting coating material and its preparation method and application, aiming to solve the problems of high cost of deicing, environmental pollution caused by deicing agents, harm to roads and the environment, and the technology that cannot function effectively for a long time question. The coating material is made of the following raw materials: deicing agent, bonding material, hydrophobic coating material, hydrophilic coating material, hydrophobic plasticizer, hydrophilic plasticizer, glycerin, anti-sticking agent, Talc powder, filler, semi-reinforcing agent, leveling agent, coupling agent, defoamer, porogen, hydrophobic fumed silica. And further provide a preparation method of the coating material, and apply it to ice melting of traffic roads. The invention does not contain harmful ions, does not cause corrosion and does not damage the environment when deicing for a long time, and has a better maintenance effect on the road surface; the raw material has a wide range of sources, the cost is low, the production process is simple and easy to operate, and can be popularized and applied in a wide range; It reduces a lot of manpower and material resources and has important economic value.

The invention discloses a tooling and a method for cleaning a CMOS image sensor circuit, belonging to the field of CMOS image sensor circuit packaging. Compared with the traditional method, the present invention can quickly and effectively remove the contamination, dust and other forms of redundant matter attached to the surface of the chip, the casing and the glass cover, and solve the problem that the photosensitive part of the CMOS image sensor circuit is damaged due to the redundant matter inside. The problem of low reliability caused by the formation of bad spots due to shading will not affect the bonding strength of the bonding wire inside the circuit. The method of the present invention can effectively remove redundant substances inside the CMOS image sensor circuit, ensure the reliability of the CMOS image sensor circuit after packaging, effectively shorten the production cycle, and the cleaning method is simple, practical, easy to realize and strong in operability.

An additive of phenolic resin, phenolic resin containing it and its production are disclosed. The procedure is carried out by mixing 3-25% sodium carbonate solution 70-80 proportion with gynesin residue powder 20-30 proportion, heating to 70-80 degrees C, reacting for 3-6hrs, lowering temperature to 30 degrees C to obtain homogeneous 200-400mPas gynesin residue mucus as additive of phenolic resin, mixing alkali soluble phenolic resin with gynesin residue powder in proportion of 90-50:10-50 and obtain the final product. It is cheap and has less formaldehyde releasing account.

A copper foil for micro wiring comprises; forming a composite metal layer on the surface to be bonded of the copper foil, by electrolyzing it in a plating bath which contains copper ion, ion of metals selected from tungsten or molybdenum, ion of metals selected from nickel, cobalt, iron, or zinc, and chloride ion of 1-100 mg / l, at an electric current density of less than limiting current density of the bath; forming a dendritic copper electrodeposited layer on the composite metal layer, by electrolyzing it in a plating bath containing copper ion, at the electric current density of more than the limiting current density of the bath; and forming coarsened layer consisting of copper, by further electrolyzing it at the current density of less than the limiting current density of the bath to form knotty copper.

The invention relates to the technical field of removing formaldehyde from boards, and discloses a composite formaldehyde scavenger comprising the following components: MOFs, modified starch, fluorinated polyether, xanthan gum, ethylene urea, epoxy fatty acid methyl ester and deionized water . The invention also provides a preparation method of the composite formaldehyde scavenger. The invention also provides a method for removing aldehydes from wood-based panels: mixing a compound formaldehyde scavenger in the adhesive; hot-pressing the veneer paper soaked in the mixed adhesive on the surface of the core board; and heat-treating the veneer wood-based panel. The invention can continuously absorb and remove the formaldehyde and VOC released from the wood-based panel, provides a formaldehyde-free wood-based panel, and avoids formaldehyde pollution and harm to users.