Two-layer two-sided flexibility copper clad plate and method for preparing same

Abstract

The invention provides a two-layer two-sided flexibility copper clad plate and a method for preparing the same. The two-layer two-sided flexibility copper clad plate comprises two copper foil layers and a thermoplastic polyimide layer between the two copper foil layers. The thermoplastic polyimide layer is prepared by dissolving aromatic diamine and aromatic diandhydrides in a ratio of 0.9:1.1 in a polarity aprotic solvent to be reacted to generate a precursor thermoplastic polyamic acid solution and imidize the precursor thermoplastic polyamic acid solution at a high temperature. The thermoplastic polyimide layer comprises organic silicon polymer fillers which have good compatibility with organic resin, and the adding amount of the organic silicon polymer fillers is 1% to 40% of the total mass of all solid reactants of polyimide resins. The coefficient of thermal expansion of the thermoplastic polyimide can be reduced apparently to be close to the thermal expansion coefficients of copper foil and non-thermoplastic polyimide by adding the organic silicon polymer fillers, accordingly, curly and warping problems of the two-layer two-sided flexibility copper clad plate in the preparation process are solved.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a two-layer double-sided flexible copper clad laminate and a manufacturing method thereof. Background technique [0002] At present, the polyimide resin used in the two-layer double-sided flexible copper clad laminate is divided into non-thermoplastic polyimide (PI) and thermoplastic polyimide (TPI). Non-thermoplastic polyimide with low thermal expansion coefficient has high heat resistance, good dimensional stability and excellent mechanical properties, but its bonding strength with metal substrates is low and it is difficult to use alone; thermoplastic polyimide is due to It can melt at high temperature, so it has good bonding ability, but its heat resistance, mechanical properties and dimensional stability are not as good as non-thermoplastic polyimide. [0003] Therefore, the existing commercial two-layer double-sided flexible copper-clad laminates all adopt the struc...

AI Technical Summary

Problems solved by technology

However, with this method, since the CTE of TPI is still far from that of PI and copper foil, there will be problems such as curling and warping of the board during the production process, resulting in difficulties in production and a decline in product qualification rate

Although the thermal expansion coefficient of TPI can be reduced by adding inorganic fillers, such as silica, talcum powder, mica powder, etc., it will inevitably reduce the adhesion of TPI to a large extent, thereby reducing the FPC board. reliability

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