Two-layer two-sided flexibility copper clad plate and method for preparing same

A flexible copper-clad laminate and double-sided technology is applied in the field of two-layer double-sided flexible copper-clad laminate and its production. It can solve the problems of product qualification rate decline, production difficulties, and large copper foil gap, and achieve the goal of ensuring reliability. Effect

Active Publication Date: 2012-11-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with this method, since the CTE of TPI is still far from that of PI and copper foil, there will be problems such as curling and warping of the board during the production process, resulting in difficulties in production and a decline in product qualific

Method used

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  • Two-layer two-sided flexibility copper clad plate and method for preparing same

Examples

Experimental program
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Effect test

Synthetic example 1

[0061]Add ODA 18.0g (0.090mol), TPE-R 15.8g (0.054mol), BAPP 14.8g (0.036mol), 180g NMP to a 1000ml three-neck flask equipped with a temperature-controlled water bath and a stirring device, and stir at room temperature until After the solid is completely dissolved, add a preformed solution containing 18.5g of organosilicon polymer filler (KMP-605, manufactured by Shin-Etsu Chemical Co., Ltd.) and 100g of NMP. The preformed solution is dispersed by a ball mill before adding BPDA 10.6g (0.036mol), ODPA 28.0g (0.09mol), BTDA 17.4g (0.054mol) were added to the reactor, rinsed with 80g NMP, and stopped after 5 hours of continuous stirring at room temperature to obtain the thermoplastic polyimide precursor polyamic acid solution A1 .

Synthetic example 2

[0063] Add ODA 18.0g (0.090mol), TPE-R 15.8g (0.054mol), BAPP 14.8g (0.036mol), 180g NMP to a 1000ml three-neck flask equipped with a temperature-controlled water bath and a stirring device, and stir at room temperature until After the solid is completely dissolved, add a preformed solution containing 26.2g of silicone polymer filler (KMP-597, manufactured by Shin-Etsu Chemical Co., Ltd.) and 100g of NMP. Before the preformed solution is added, it is dispersed by a ball mill. BPDA 10.6g (0.036mol), ODPA 28.0g (0.09mol), BTDA 17.4g (0.054mol) were added to the reactor, rinsed with 80g NMP, and stopped after 5 hours of continuous stirring at room temperature to obtain the thermoplastic polyimide precursor polyamic acid solution A2 .

Synthetic example 3

[0065] Add ODA 18.0g (0.090mol), TPE-R 15.8g (0.054mol), BAPP 14.8g (0.036mol), 180g NMP to a 1000ml three-neck flask equipped with a temperature-controlled water bath and a stirring device, and stir at room temperature until After the solid is completely dissolved, add a preformed solution containing 18.5 g of organosilicon polymer filler (X-52-854, manufactured by Shin-Etsu Chemical Co., Ltd.) and 100 g of NMP. ), ODPA 28.0g (0.09mol), BTDA 17.4g (0.054mol) were added to the reactor, rinsed with 80g NMP, and stopped after 5 hours of continuous stirring at room temperature to obtain the thermoplastic polyimide precursor polyamic acid Solution A3.

[0066] Synthesis example of non-thermoplastic polyimide:

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PUM

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Abstract

The invention provides a two-layer two-sided flexibility copper clad plate and a method for preparing the same. The two-layer two-sided flexibility copper clad plate comprises two copper foil layers and a thermoplastic polyimide layer between the two copper foil layers. The thermoplastic polyimide layer is prepared by dissolving aromatic diamine and aromatic diandhydrides in a ratio of 0.9:1.1 in a polarity aprotic solvent to be reacted to generate a precursor thermoplastic polyamic acid solution and imidize the precursor thermoplastic polyamic acid solution at a high temperature. The thermoplastic polyimide layer comprises organic silicon polymer fillers which have good compatibility with organic resin, and the adding amount of the organic silicon polymer fillers is 1% to 40% of the total mass of all solid reactants of polyimide resins. The coefficient of thermal expansion of the thermoplastic polyimide can be reduced apparently to be close to the thermal expansion coefficients of copper foil and non-thermoplastic polyimide by adding the organic silicon polymer fillers, accordingly, curly and warping problems of the two-layer two-sided flexibility copper clad plate in the preparation process are solved.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a two-layer double-sided flexible copper clad laminate and a manufacturing method thereof. Background technique [0002] At present, the polyimide resin used in the two-layer double-sided flexible copper clad laminate is divided into non-thermoplastic polyimide (PI) and thermoplastic polyimide (TPI). Non-thermoplastic polyimide with low thermal expansion coefficient has high heat resistance, good dimensional stability and excellent mechanical properties, but its bonding strength with metal substrates is low and it is difficult to use alone; thermoplastic polyimide is due to It can melt at high temperature, so it has good bonding ability, but its heat resistance, mechanical properties and dimensional stability are not as good as non-thermoplastic polyimide. [0003] Therefore, the existing commercial two-layer double-sided flexible copper-clad laminates all adopt the struc...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B27/06B32B27/20B32B27/28B32B37/02C08G73/10H05K1/03
Inventor 周韶鸿张翔宇茹敬宏
Owner GUANGDONG SHENGYI SCI TECH
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