Anisotropic conductive film

An anisotropic, conductive film technology, applied in the direction of conductive connections, conductive adhesives, circuits, etc., can solve the problems that anisotropic conductive films cannot correspond to TCP substrates and COF substrates, etc., to improve connection reliability and delay polymerization Effect

Active Publication Date: 2012-10-31
DEXERIALS CORP
View PDF8 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the actual assembly scene, the anisotropic conductive film for the TCP substrate and the anisotropic conductive film for the COF substrate have to be used separately, and it is impossible to use a single anisotropic conductive film to correspond to the TCP substrate and the COF substrate. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive film
  • Anisotropic conductive film
  • Anisotropic conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-12、 comparative example 1-6

[0060] The compounding composition of Table 2 was uniformly mixed according to the conventional method, respectively, and the composition for layer formation containing electroconductive particle and the composition for insulating adhesive layer formation were prepared. Next, the composition for forming an insulating adhesive layer was coated on the release-treated polyester film with a bar coater to a dry thickness of 18 μm, and was dried by blowing hot air at 70° C. for 5 minutes. Form an insulating adhesive layer. Next, the layer-forming composition containing conductive particles was coated on the insulating adhesive layer with a bar coater to a dry thickness of 17 μm, and dried by blowing hot air at 70° C. for 5 minutes, thereby A layer containing conductive particles is formed. Thus an anisotropic conductive film was obtained.

[0061] [Table 2]

[0062]

[0063]

[0064] PEMP: Pentaerythritol tetrakis(3-mercaptopropionate), SC Organic Chemical Co., Ltd.

[0065...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to view more

Abstract

An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comprises a polymerizable acrylic compound, a film-forming resin, a polymerization initiator and conductive particles, wherein the insulating adhesive layer and the conductive-particle -containing layer each contain a thiol compound in order to further improve the reliability of connection without lowering the bond strength to an adherend. The thiol compound includes pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylol-propane tris(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), and so on.

Description

technical field [0001] The present invention relates to anisotropic conductive films. Background technique [0002] When connecting a liquid crystal panel to a tape carrier package (TCP, tape carrier package) substrate or a chip on film (COF, chip on film) substrate via a thermosetting anisotropic conductive film, or when connecting a TCP substrate or a COF substrate When connecting to a printed wiring board (PWB) via a thermosetting anisotropic conductive film, in order to shorten the hot pressing time, it has been proposed that a polymerizable acrylic compound curable at a relatively low temperature and in a short time, a film-forming resin, An organic peroxide or the like as a polymerization initiator constitutes a binder resin composition used in an anisotropic conductive film (Patent Document 1). [0003] However, when using an anisotropic conductive film containing a polymerizable acrylic compound and the above-mentioned organic peroxide to perform anisotropic conduct...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01B32B27/00C09J4/02C09J7/02C09J9/02C09J11/04C09J11/06C09J201/00H01B5/16C09J7/22C09J7/35
CPCH01L2224/2939C09J2201/602H01L2224/29344C09J4/00H01L2224/29355C09J2203/326H01L2224/29082C08K5/37H01L2224/32225H01L2224/29339H01L2224/29444H01L2224/2919B32B7/12H01L2224/2929H01L2224/29455B32B2439/00H01L24/32C09J7/0242H01L2224/29418C09J2205/102B32B27/308H01L24/29C09J2205/106C09J2433/006B32B2307/202C09J2433/00C08K5/14H01L2924/07802H01L2924/351H01L2924/15788C09J7/35C09J7/22Y10T156/10Y10T428/2878C09J2301/314C09J2301/41C09J2301/408H01L2924/00012H01L2924/00014H01L2924/00C09J11/00C09J133/04
Inventor 宫內幸一佐藤伸一山田泰伸
Owner DEXERIALS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap