Production method of copper foil for fine line use

A technology of fine circuit and copper foil, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve problems such as open circuit or insulation failure of fine circuit

Inactive Publication Date: 2002-05-08
NIPPON DENKAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the protrusions on the roughened surface are not completely etched away, the copper particles remai

Method used

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  • Production method of copper foil for fine line use
  • Production method of copper foil for fine line use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] (1) Using a 10% sulfuric acid solution, a 12-μm-thick electrodeposited copper foil (surface roughness Rz of the matte side: 1.5 μm measured according to JIS B 0602) was acid-washed in the solution for 20 seconds.

[0057] (2) Then wash the copper foil with water, the matte surface (adhesive surface) of the copper foil is at 3A / dm 2 Electrolytic treatment at current density for 8 seconds in a plating bath containing 50 g / L copper sulfate pentahydrate, 2 g / L sodium molybdate dihydrate, 50 g / L nickel sulfate hexahydrate and 20 mg / liter of chloride ions (if used, hydrochloric acid was used in all examples and comparative examples), the pH of the solution was adjusted to 2.5, the temperature of the plating bath was 30 ° C, and a composite metal containing copper, molybdenum and nickel was formed on the bonding surface of the copper foil layer. The amount of metal coating in the composite metal layer was measured with an ICP (inductively coupled plasma luminescence) analyz...

Embodiment 2

[0064] In the same manner as in Example 1, after acylation and water washing of the same electrolytic copper foil used in Example 1, the matte surface (adhesive surface) of the copper foil was plated at -30°C and the pH was adjusted to 2.0. In bath, at 3A / dm 2 Electrolyze for 8 seconds at current density to form a composite metal layer containing copper, molybdenum, cobalt and iron on the bonding surface of copper foil, the plating bath contains 50 g / L copper sulfate pentahydrate, 2 g / L sodium molybdate Dihydrate, 30 g / L Cobalt Sulfate Heptahydrate, 30 g / L Ferrous Sulfate Heptahydrate, and 40 mg / L Chloride. The amount of metal coating in the composite metal layer was measured with an ICP (inductively coupled plasma luminescence) analyzer, and the copper was 7900 μg / dm 2 , molybdenum is 60μg / dm 2 , cobalt is 12μg / dm 2 , iron 11μg / dm 2 . The roughness Rz of the treated surface was 1.5 μm. Subsequently, in the same manner as in Example 1, a copper-containing roughened layer...

Embodiment 3

[0067] In the same manner as in Example 1, after acylation and water washing of the same electrolytic copper foil used in Example 1, the matte surface (adhesive surface) of the copper foil was plated at -30°C and the pH was adjusted to 2.5. In bath, at 4A / dm 2 Electrolyze for 6 seconds at current density to form a composite metal layer containing copper, molybdenum and zinc on the bonding surface of copper foil, the plating bath contains 50 g / L copper sulfate pentahydrate, 2 g / L sodium molybdate dihydrate substance, 50 g / L zinc sulfate heptahydrate and 5 mg / L chloride ion. The amount of metal coating in the composite metal layer was measured with an ICP (inductively coupled plasma luminescence) analyzer, and the copper was 7900 μg / dm 2 , molybdenum is 130μg / dm 2 , zinc is 20μg / dm 2 . The roughness Rz of the treated surface was 1.5 μm. Subsequently, in the same manner as in Example 1, a copper-containing roughened layer was formed. Copper content in the roughened layer is...

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Abstract

A copper foil for micro wiring comprises; forming a composite metal layer on the surface to be bonded of the copper foil, by electrolyzing it in a plating bath which contains copper ion, ion of metals selected from tungsten or molybdenum, ion of metals selected from nickel, cobalt, iron, or zinc, and chloride ion of 1-100 mg/l, at an electric current density of less than limiting current density of the bath; forming a dendritic copper electrodeposited layer on the composite metal layer, by electrolyzing it in a plating bath containing copper ion, at the electric current density of more than the limiting current density of the bath; and forming coarsened layer consisting of copper, by further electrolyzing it at the current density of less than the limiting current density of the bath to form knotty copper.

Description

Background of the invention [0001] (a) Field of Invention [0002] The present invention relates to a method of manufacturing copper foil for fine wiring, which has a bonding surface uniformly roughened to a low surface roughness, has good etching properties, is capable of high-density fine wiring, and Bonds firmly to substrate. [0003] (b) Description of relevant fields [0004] The bonding surface of the copper foil used for printed circuit boards is laminated on the resin substrate. In the past, it was generally pre-roughened by some method to improve the bonding strength. For electrolytic copper foil, electroplating is mainly used for roughening treatment. An example of this plating method is disclosed in Japanese Patent Application Examination Publication No. 53-39376 (1978). According to this method, first, so-called burn plating is performed at a limiting current density or higher in an acidic copper plating bath to form dendrite plating on at least one bonding sur...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/10C25D5/16H05K3/38
CPCC25D5/16H05K3/384C25D5/10H05K2201/0355H05K2203/0723H05K2203/0307C25D5/605C25D3/38
Inventor 远藤安浩原広树八木桥敦睦
Owner NIPPON DENKAI
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