Tool and method for cleaning circuit of cmos image sensor

An image sensor and cleaning device technology, which is applied to circuits, image communications, color TV components and other directions, can solve the problems of reducing the circuit performance of CMOS image sensors, chip surface damage, etc., and achieves a simple and practical cleaning method, high cleanliness, Guaranteed effect of circuit performance

Active Publication Date: 2021-11-09
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cleaning method is generally manual scrubbing, which can easily cause damage to the chip surface and reduce the performance of the CMOS image sensor circuit

Method used

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  • Tool and method for cleaning circuit of cmos image sensor
  • Tool and method for cleaning circuit of cmos image sensor
  • Tool and method for cleaning circuit of cmos image sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0040] Tooling is processed according to the present invention. In an environment with a temperature of 23°C and a humidity of 40%, wear an anti-static wristband and brand-new finger cots, pinch the edge of the circuit ceramics with your fingers, and pick up the circuit steadily to prevent your fingers from slipping into the circuit cavity and the circuit from falling. One side of the bottom is the rotation axis, and the circuit is placed on the UV film supported by the dicing material ring in a rotating manner. Fix the circuit without moving, use a scraper to scrape from one end of the circuit to the other end on the lower surface of the UV film, and remove the visible air bubbles on the contact surface between the circuit and the UV film. Remove the fixed dicing material ring, UV film and the overall structure of the CMOS image sensor circuit from the bracket, and place them on the cleaning device workbench. When placed, the moisture on the surface of the CMOS image sensor c...

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PUM

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Abstract

The invention discloses a tooling and a method for cleaning a CMOS image sensor circuit, belonging to the field of CMOS image sensor circuit packaging. Compared with the traditional method, the present invention can quickly and effectively remove the contamination, dust and other forms of redundant matter attached to the surface of the chip, the casing and the glass cover, and solve the problem that the photosensitive part of the CMOS image sensor circuit is damaged due to the redundant matter inside. The problem of low reliability caused by the formation of bad spots due to shading will not affect the bonding strength of the bonding wire inside the circuit. The method of the present invention can effectively remove redundant substances inside the CMOS image sensor circuit, ensure the reliability of the CMOS image sensor circuit after packaging, effectively shorten the production cycle, and the cleaning method is simple, practical, easy to realize and strong in operability.

Description

technical field [0001] The invention relates to a tooling and a method for cleaning a CMOS image sensor circuit, belonging to the technical field of CMOS image sensor circuit ceramic packaging. Background technique [0002] Compared with traditional CCD imaging technology, CMOS image sensor has the advantages of easy system integration, low power consumption, fast imaging speed, wide response range, strong radiation resistance, and low cost. The prospect of CMOS camera is very broad. [0003] The surface of the chip of the CMOS image sensor circuit is equipped with microlenses, and the surface is uneven. If there are redundant objects, the redundant objects can easily enter the pits and cause one or several pixels to fail. Therefore, the CMOS image sensor circuit is extremely sensitive to excess. Proper cleaning must be carried out before the circuit is capped to remove as much contamination as possible from the chip surface, the inside of the tube, and the glass cover. The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02H04N5/374
CPCH01L21/02082H01L21/67051H04N25/76
Inventor 冯小成李峰李洪剑荆林晓贺晋春井立鹏
Owner BEIJING MXTRONICS CORP
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