Tool and method for cleaning circuit of cmos image sensor
An image sensor and cleaning device technology, which is applied to circuits, image communications, color TV components and other directions, can solve the problems of reducing the circuit performance of CMOS image sensors, chip surface damage, etc., and achieves a simple and practical cleaning method, high cleanliness, Guaranteed effect of circuit performance
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2021-11-09
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Abstract
Description
technical field
[0001] The invention relates to a tooling and a method for cleaning a CMOS image sensor circuit, belonging to the technical field of CMOS image sensor circuit ceramic packaging. Background technique
[0002] Compared with traditional CCD imaging technology, CMOS image sensor has the advantages of easy system integration, low power consumption, fast imaging speed, wide response range, strong radiation resistance, and low cost. The prospect of CMOS camera is very broad.
[0003] The surface of the chip of the CMOS image sensor circuit is equipped with microlenses, and the surface is uneven. If there are redundant objects, the redundant objects can easily enter the pits and cause one or several pixels to fail. Therefore, the CMOS image sensor circuit is extremely sensitive to excess. Proper cleaning must be carried out before the circuit is capped to remove as much contamination as possible from the chip surface, the inside of the tube, and the glass cover. The...
Examples
Embodiment
[0040] Tooling is processed according to the present invention. In an environment with a temperature of 23°C and a humidity of 40%, wear an anti-static wristband and brand-new finger cots, pinch the edge of the circuit ceramics with your fingers, and pick up the circuit steadily to prevent your fingers from slipping into the circuit cavity and the circuit from falling. One side of the bottom is the rotation axis, and the circuit is placed on the UV film supported by the dicing material ring in a rotating manner. Fix the circuit without moving, use a scraper to scrape from one end of the circuit to the other end on the lower surface of the UV film, and remove the visible air bubbles on the contact surface between the circuit and the UV film. Remove the fixed dicing material ring, UV film and the overall structure of the CMOS image sensor circuit from the bracket, and place them on the cleaning device workbench. When placed, the moisture on the surface of the CMOS image sensor c...