High-efficiency non-corrosion water-based soldering paste detergent

A technology without corrosion and cleaning agent, which is applied in the direction of cleaning/polishing of detergent compounding agent, detergent composition, conductive pattern, etc., can solve problems such as metal corrosion on components, and achieve the effect of fast cleaning speed

Inactive Publication Date: 2009-01-07
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the above-mentioned traditional water-based solder paste cleaning agent is easy to cause corrosion of the metal on the assembly, the purpose of the present invention is to provide a high-efficiency non-corrosive water-based solder paste cleaning agent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] This high-efficiency non-corrosive water-based solder paste cleaning agent is formulated according to the following components (mass percentage):

[0013] Triethanolamine 60%

[0014] Glucose 8%

[0015] Imidazoline 0.5%

[0016] 2-Ethylhexanol 20%

[0017] Tween 11.5%

[0018] Effect: The ultrasonic cleaning time is 3 minutes, and the corrosion inhibition efficiency is 91%.

Embodiment 2

[0020] This high-efficiency non-corrosive water-based solder paste cleaning agent is formulated according to the following components (mass percentage):

[0021] Triethanolamine 60%

[0022] Glucose 4%

[0023] Imidazoline 0.5%

[0024] 2-Ethylhexanol 15.5%

[0025] Tween 20%

[0026] Effect: The ultrasonic cleaning time is 2 minutes, and the corrosion inhibition efficiency is 95%.

Embodiment 3

[0028] This high-efficiency non-corrosive water-based solder paste cleaning agent is formulated according to the following components (mass percentage):

[0029] Triethanolamine 70%

[0030] Glucose 1%

[0031] Imidazoline 1%

[0032] 2-Ethylhexanol 15%

[0033] Tween 13%

[0034] Effect: The ultrasonic cleaning time is 1 minute, and the corrosion inhibition efficiency is 96%.

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PUM

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Abstract

The invention discloses a high efficiency non-corrosive water-based solder paste cleaning agent, comprising triethanolamine, glucose, imidazoline, 2-ethyl hexanol and tween. The glucose and the imidazoline are used as inhibitor. The portions of the high efficiency non-corrosive water-based solder paste cleaning agent are as follows: 60-70 percent of triethanolamine, 1-8 percent of glucose, 0.5-1 percent of imidazoline, 10-20 percent of 2-ethyl hexanol and 10-20 percent of tween. The high efficiency non-corrosive water-based solder paste cleaning agent uses the formation of the inhibitor and the cleaning agent, and so the high efficiency non-corrosive water-based solder paste cleaning agent has the advantages of high efficiency, non-corrosive, environmental protection, rapid cleaning speed and so on.

Description

technical field [0001] The invention relates to the field of solder paste cleaning agent, more specifically, relates to a high-efficiency non-corrosive water-based solder paste cleaning agent, which is mainly used for cleaning electronic circuit boards. Background technique [0002] During the use of traditional water-based solder paste cleaners, in addition to the dissolution of dirt, it is also accompanied by metal corrosion, which affects the cleaning effect and the performance of the material. Contents of the invention [0003] In order to solve the problem that the above-mentioned traditional water-based solder paste cleaning agent is easy to cause metal corrosion on components, the object of the present invention is to provide a highly efficient non-corrosive water-based solder paste cleaning agent. [0004] In order to achieve the above-mentioned purpose, a kind of high-efficiency non-corrosion water-based solder paste cleaning agent provided by the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/66C11D3/26H05K3/26C11D3/20
Inventor 高延敏李照磊
Owner JIANGSU UNIV OF SCI & TECH
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