Window base material, card having module housed therein, and method for manufacturing card having module housed therein

A base material and window technology, which is applied in the field of built-in modules, can solve the problems of lower yield and poor appearance, and achieve the effect of keeping confidentiality and suppressing poor appearance

CN101529451AInactive Publication Date: 2009-09-09TOPPAN MOORE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2009-09-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention discloses a window base material is provided with an intermediate layer having a window section made of a transparent resin and a colored section made of a colored resin surrounding the window section; and transparent first base material and second base material sandwiching the intermediate layer. A card having a module housed therein is provided with a module having a display element; an adhesive layer covering the module; and a pair of third base material and fourth base material sandwiching the module by having the adhesive layer in between. The third base material is composed of the window base material, and the display section of the display element is arranged to face the window section of the window base material. Thus, the easily manufactured card which houses the display element as an electronic component and permits the display section of the display element to be visually inspected from the external is provided.
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Description

technical field

[0001] The present invention relates to a built-in-module card that incorporates a module including an electronic component such as an IC chip, and more particularly to a built-in-module card that incorporates a display element as an electronic component so that the display portion of the display element can be viewed from the outside.

[0002] In addition, the present invention relates to a window base material used for the above-mentioned built-in-module card, a built-in-module card including the window base material, and a method for manufacturing the built-in-module card.

[0003] This application claims the priority of Japanese Patent Application No. 2006-301520 and Japanese Patent Application No. 2006-301522 filed in Japan on November 7, 2006, and uses the contents thereof here. Background technique

[0004] Currently, in cards such as IC cards that incorporate modules having electronic components such as IC chips and diodes, in order to allow visual in...

Examples

Embodiment Construction

[0031] The best mode of the window base material of the present invention, a built-in-module card including the window base material, and a manufacturing method of a built-in-module card will be described.

[0032] In addition, this aspect is an example specifically described for better understanding of the gist of the invention, and unless otherwise specified, does not limit the present invention.

[0033] [window base material] Figure 1A with Figure 1B is a schematic diagram showing one embodiment of the window substrate of the present invention, Figure 1A is the floor plan, Figure 1B is along Figure 1A A cross-sectional view of line A-A.

[0034] Figure 1A In and B, symbol 10 denotes a window base material, 11 denotes a colored portion, 12 denotes a window portion, 13 denotes an intermediate layer, 14 denotes a first base material, and 15 denotes a second base material.

[0035]The window base material 10 of this embodiment is roughly constituted by an intermedi...