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Circuit board transferring system and circuit board transferring method

A conveying system and circuit board technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as inconvenience, difficulty in controlling the speed of placing boards, and uneven spacing between boards

Inactive Publication Date: 2011-03-30
STATE GRID CORP OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the circuit boards are placed on the conveyor belt manually, the speed of placing the boards is not easy to control, so that the spacing of the circuit boards on the conveyor belt is uneven, which is not convenient for the subsequent process.

Method used

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  • Circuit board transferring system and circuit board transferring method
  • Circuit board transferring system and circuit board transferring method
  • Circuit board transferring system and circuit board transferring method

Examples

Experimental program
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Embodiment Construction

[0015] The circuit board transmission system and the circuit board transmission method provided by the technical solution will be further described in detail below with reference to the drawings and embodiments.

[0016] see figure 1 The circuit board conveying system 10 provided by the embodiment of the technical solution includes a first conveying device 11 , a second conveying device 12 , a sensing device 13 and a controller 14 .

[0017] The first conveying device 11 and the second conveying device 12 are used for conveying circuit boards. The first conveying device 11 and the second conveying device 12 are adjacently arranged along the circuit board conveying direction, thereby the circuit board can be conveyed to the second conveying device 12 from the first conveying device 11, and further the circuit board can be conveyed from the second conveying device 12 Send to the subsequent processing device, for example, developing / etching / stripping (Developing / Etching / Strippin...

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PUM

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Abstract

The invention provides a circuit board transferring system which comprises a first transferring device, a second transferring device, an induction device and a controller, wherein the first transferring device and the second transferring device are adjacently arranged along the transferring direction of circuit boards; the induction device comprises a first inductor and a second inductor, wherein the first inductor is disposed above the first transferring device and close to the second transferring device, and the second inductor is disposed above the second transferring device and close to the first transferring device, the induction device is used for inducting the position of the two adjacent circuit boards respectively on the first and the second transferring devices, and the controller is connected with the induction device and the first transferring device and used for obtaining the distance of the circuit boards according to the inducting result, thereby controlling the transferring speed of the first transferring device. The invention also provides a circuit board transferring method. In the technical schemes of the invention, the circuit board transferring device and the circuit board transferring method can effectively control the distance of the board boards.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board transmission system and a circuit board transmission method. Background technique [0002] The manufacturing process of the circuit board usually includes steps such as blanking, conductive circuit making, via hole making, solder mask printing, and gold plating. Cutting refers to cutting raw materials such as copper-clad laminates into substrates of appropriate size for production. The production of conductive lines refers to making the copper foil on the substrate into a designed conductive pattern, which is generally formed by steps such as coating photoresist, exposure and development, etching lines, and photoresist removal. See Moon-Youn Jung et al. published in 2004 in IEEE 17th International Conference on Micro Electro Mechanical Systems, "Novel lithography process for extreme deep trench by using laminated negative dry film resist". The manufacturi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K13/02
Inventor 朱银奎毕庆鸿涂成达
Owner STATE GRID CORP OF CHINA