transmission tool

Abstract

A transfer tool comprises: a first support framer that is installed to be movable along a transfer tool guide track of a semiconductor processor; a pair of second support frames that is connected with the first support frame through a gap and has a plurality of pickups having gap therebetween and picking up the semiconductor devices; and a vertical gap controller for controlling the gap of the pair of the second support frames by moving a pair of second support frames, wherein the vertical gap controller includes: a vertical driving unit installed on the first support frame to generate a vertical driving force; and a linear moving unit installed on the first support frame and connected to the second support frame; the gap between the second support frames is controlled by the linear movement of vertical driving unit.

Description

technical field [0001] The present invention relates to a transfer tool, in particular to a transfer tool capable of picking up an item to be transferred (such as a semiconductor device) to transfer the item to another location. Background technique [0002] Typically, a semiconductor device that has undergone a complete packaging process needs to undergo multiple tests, such as burn-in tests to test reliability through external thermal factors, and electrical tests to test direct current (DC) characteristics. According to the measurement results, the quality of semiconductor devices can be distinguished. [0003] During the assay and sorting process, semiconductor devices are loaded onto trays and / or stages, and the trays are conveyed continuously. [0004] The semiconductor devices loaded onto the trays and / or stages are picked up by the transfer tool to be transferred to the trays, trays, stages, etc. of the inspection apparatus. [0005] A conventional transfer tool in...

AI Technical Summary

Problems solved by technology

Due to the asymmetrical center of gravity of the pair of mounts, this can lead to inaccurate control of the pickup

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