Cylindrical grinding apparatus and method for grinding

Abstract

Cylindrical grinding equipment for grinding the side face of a columnar ingot, comprising at least three rollers, and a centering means consisting of an arm for supporting the rollers and coming into pressure contact with the rollers by advancing toward or retracting from the ingot from the horizontal direction, characterized in that the columnar ingot is mounted on a table vertically and transferred from the table onto a clamp before the end faces on the opposite sides of the ingot are held in the vertical direction by means of a pair of clamps, the ingot is then advanced or retracted by the centering means from the horizontal direction while being rotated about the axis by a rotating means, the axis of rotation of the rotating means is aligned with the central axis of the ingot by bringing the roller into pressure contact with the side face of the ingot, and then the ingot is ground by means of an abrasive wheel. Consequently, cylindrical grinding equipment and a grinding method capable of enhancing the grinding efficiency of an ingot are provided.

Description

technical field [0001] The present invention relates to a cylindrical grinding apparatus used for cylindrical grinding of a single crystal ingot in semiconductor manufacturing, and a grinding method using the cylindrical grinding apparatus. in process. Background technique [0002] A single crystal ingot produced by the Czochralski method (CZ method) has a cylindrical body and a tapered end (top and tail). In addition, in the cutting process of the block, the tapered end portions are cut off by an inner peripheral blade slicer, an outer peripheral blade slicer, a band saw, or the like, leaving only a cylindrical shape. Crystal body. Further, the body portion is cut into a plurality of blocks as necessary. Then, after grinding the outer peripheral surface of each ingot to have a predetermined diameter, the bulk of each ingot is cut by a wire saw or the like, and then sliced ​​into a plurality of silicon chips. [0003] As a grinding device for grinding the outer periphera...

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Problems solved by technology

Therefore, although the centering can be carried out with good precision, it takes a lot of time until the process of g

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