Device for measuring solid material heat conductivity

A solid material, thermal conductivity technology, applied in the field of thermal conductivity measurement devices, can solve the problems of complex operation, low accuracy, large error, etc., and achieve the effects of good stability, low cost and convenient operation

Inactive Publication Date: 2011-01-19
EAST CHINA NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In view of this, the present invention aims at the deficiencies of the prior art, and designs a new device for measuring thermal conductivity of solid materials, which overcomes the shortcomings of the above-mentioned method, such as large error, complicated operation, low accuracy and high cost.

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  • Device for measuring solid material heat conductivity
  • Device for measuring solid material heat conductivity
  • Device for measuring solid material heat conductivity

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Embodiment Construction

[0029] The present invention will be described in further detail below in conjunction with accompanying drawing of description and specific embodiment:

[0030] see figure 1 , which is a three-dimensional schematic diagram of a measuring device for the thermal conductivity of solid materials in the example of the present invention. This device comprises, vacuum chamber 1, and vacuum chamber 1 is a cylindrical airtight container, and it has an opening A on the vacuum chamber 1 that can be closed (referring to figure 2 ), the side cover 2 can be opened or closed, so that the sample to be tested can be put into the vacuum chamber 1 or taken out from the vacuum chamber 1 through the opening A. In addition, one end of an exhaust pipe 3 extends to the inner space of the vacuum chamber 1 , and the other end is connected to a vacuum device (not shown). The inside of the vacuum chamber 1 can be evacuated to eliminate the bad influence of the gas, so that the heat can only be tra...

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Abstract

The invention discloses a device for measuring solid material heat conductivity. The device comprises a closed vacuum cavity, a heating source, a first metal block, a second metal block, a third metal block and a fourth metal block, cooling devices, and temperature measuring devices, wherein the vacuum cavity is connected with an external vacuumizing device through an exhaust tube; the heating source is arranged in the vacuum cavity; the first metal block and the second metal block are respectively adhered to the two sides of the hearting source; an accommodating space is formed between the first metal block and the third metal block; the accommodating space is formed between the second metal block and the fourth metal block; the accommodating spaces are used for placing a solid material to be measured; the cooling devices are arranged outside the third metal block and the fourth metal block; and the temperature measuring devices are arranged on each metal block and are used for measuring the temperature of the metal blocks. The device of the invention can acquire measured values more accurately, and can improve final measurement precision.

Description

technical field [0001] The invention relates to a measuring device for thermal conductivity, in particular to a measuring device for measuring the thermal conductivity of solid materials with poor thermal conductivity. Background technique [0002] The thermal conductivity of materials is an important parameter to study the physical properties of materials. In scientific research, teaching, production and other departments, it is required to predict or measure the thermal conductivity of materials. Thermal conductivity is a physical quantity that reflects the thermal conductivity of materials. It is not only a basis for evaluating the thermal properties of materials, but also a design basis for materials in application. Therefore, the measurement of thermal conductivity of materials in scientific experiments and engineering technology has become a new development method. material key. [0003] At present, there are three main methods for measuring the thermal conductivity o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 孙新形孙卓潘丽坤张明昌陈晓红郭平生
Owner EAST CHINA NORMAL UNIV
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