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Printed circuit board processing technology and processing equipment

A technology for printed circuit boards and processing equipment, applied in the secondary treatment of printed circuits, cleaning/polishing of conductive patterns, etc., can solve the problems of low efficiency of heavy work, incomplete cleaning of residues, etc., achieve the best removal effect, and completely remove photosensitive ink , Improve the effect of working environment temperature

Active Publication Date: 2016-05-11
东莞市五株电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the technical problems of low rework efficiency of printed circuit boards and incomplete cleaning of residues in the prior art, the present invention provides a printed circuit board processing technology that efficiently and thoroughly removes residues on the surface of printed circuit boards

Method used

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  • Printed circuit board processing technology and processing equipment
  • Printed circuit board processing technology and processing equipment
  • Printed circuit board processing technology and processing equipment

Examples

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] see figure 1 , is a schematic diagram of the side structure of a printed circuit board processing equipment disclosed in the present invention. The printed circuit board processing equipment 2 is used in the printed circuit board processing technology to completely remove and clean the photosensitive ink. The printed circuit board processing equipment 2 includes a tank body 21 , an anti-corrosion layer 23 , a support frame 25 , a temperature adjustment device 27 and an ultrasonic cleaning device 29 .

[0028] The tank body 21 includes a top edge 211 , a side wall 213 and a bottom wall 215 . The side wall 213 cooperates with the bottom wall 215 to form an opening receiving space, and the bottom wall 215 is connected to one end of the side wall 213 and closed to enclose it. The top edge 211 is an extension portion extending from the other edge of the side wal...

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PUM

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Abstract

The invention provides a machining process of a printed circuit board, which comprises the steps of: providing a sensitizing printing ink cleaning solution to be accommodated in an accommodating space of a groove body; providing a printed circuit board to be cleaned to be hung between ultrasonic vibration boards; starting a temperature regulating device for controlling the sensitizing printing ink cleaning solution to be at a set temperature; and starting an ultrasonic cleaning device for cleaning the printed circuit board. According to the machining process of the printed circuit board, the working environment and the process reliability of the printed circuit board are ensured by adopting the ultrasonic cleaning device and the temperature regulating device, residues are effectively removed, the cleanness and the cleaning efficiency of the printed circuit board are greatly increased, the cost is lowered, and the reworking yield of the printed circuit board is increased. Meanwhile, the invention also provides a machining device of the printed circuit board.

Description

technical field [0001] The invention relates to a printed circuit board processing technology and processing equipment. Background technique [0002] Printed circuit boards (Printed Circuit Board, PCB) include rigid printed circuit boards (Rigid Printed Circuit Board, Rigid PCB), flexible printed circuit boards (Flexible Printed Circuit Board, Flexible PCB) and soft and hard printed circuit boards (Rigid Flexible PCB). Printed circuit boards are widely used in various electronic components because of their high wiring density, light weight, and thin thickness. [0003] With the development requirements of multi-function, miniaturization and high performance of electronic products, the printed circuit board (Printed Circuit Board, PCB) is developing in the direction of high-level, high-density and thin core board. At the same time, the structural design is becoming more and more complicated. Some electronic products need to be formed by laminating multiple printed circuit bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/26
Inventor 冉彦祥孟昭光
Owner 东莞市五株电子科技有限公司
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