Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal

A multi-component, silver solder technology, applied in welding/cutting media/materials, welding media, metal processing equipment, etc. Effects of improved shear strength, reduced cost, and improved processability

Inactive Publication Date: 2015-04-29
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the performance of brazing filler metals, rare earth elements are added to 16 kinds of brazing filler metals. As a strategic resource, the country actively takes measures to protect them. Rare earth brazing filler metals are not conducive to popularization and use.
Only four kinds of brazing alloys containing rare earth have a silver content below 30%, while other brazing alloys have a higher silver content, and the cost is correspondingly higher

Method used

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  • Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal
  • Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal

Examples

Experimental program
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Effect test

Embodiment 1

[0020] The mass percentage composition of the solder in this embodiment is: Ag: 25.02%, Cu: 36.18%, Zn: 33.84%, In: 1.04%, and the balance is Sn.

[0021] The solidus temperature of the solder in this embodiment is 713° C., the liquidus temperature is 730° C., and the temperature interval between solidus and liquidus is 17° C. The wetting ratio on the copper is 2.32, the electrical conductivity is 9.6MS / m, the microhardness is 228Hv, and the shear strength of the brazed copper-copper seam is 225.49MPa.

Embodiment 2

[0023] The composition of the solder in this embodiment is: Ag: 25.74%, Cu: 36.65%, Zn: 32.83%, In: 1.20%, and the balance is Sn.

[0024] The solidus temperature of the solder in this embodiment is 701° C., the liquidus temperature is 720° C., and the interval between the solidus and liquidus temperatures is 19° C. The wetting ratio on the copper is 2.63, the electrical conductivity is 9.5MS / m, the microhardness is 215Hv, and the shear strength of the brazed copper-copper seam is 224.62MPa.

Embodiment 3

[0026] The composition of the solder in this embodiment is: Ag: 25%, Cu: 37%, Zn: 34%, In: 1%, and the balance is Sn.

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Abstract

The invention discloses novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal. The novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal is characterized by comprising, by mass, 25.0%-26.0% of Ag, 36.0%-37.0% of Cu, 32.0%-34.0% of Zn, 1.0%-1.2% of In and the balance Sn. Silver content of the brazing filler metal is reduced by 5%, and cost is lowered. Solidus temperature is kept unchanged to be 701-713 DEG C, liquidus temperature is within the range of 720-730 DEG C and is decreased by 50 DEG C, and accordingly the interval between the solidus temperature and the liquidus temperature is decreased by 50 DEG C. In addition, wetting rate of the brazing filler metal on copper is increased by 0.5, microhardness is lowered by 50Hv, machinability is improved, and shearing strength of copper-copper brazing seams is enhanced by 80MPa.

Description

technical field [0001] The invention belongs to the technical field of solder preparation, and relates to a multi-component cadmium-free silver solder, in particular to a novel multi-component cadmium-free silver solder containing tin and indium, which can be used for brazing silver, silver alloys, and copper And copper alloy, steel and other materials. Background technique [0002] Among the silver-based solders, the cadmium-containing silver solder has the best performance, mainly because cadmium can lower the melting point of the solder, inhibit the generation of brittle phases, and make the solder have excellent performance and processing performance. After the use of cadmium-containing silver solder was banned because it was harmful to the human body, cadmium-free silver solder was actively developed at home and abroad. The research mainly focuses on two aspects. First, add other alloying elements to silver-based solder, study their effects, and find alternative elemen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30
Inventor 潘希德陈迎谢小娟陈乐生顾章平
Owner XI AN JIAOTONG UNIV
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