A kind of smart card capable of measuring the tension value of solder joint and its measurement method for the tension value of solder joint

Abstract

The invention discloses a smart card capable of measuring welding spot tension and a welding spot tension measuring method thereof. The smart card comprises a substrate and a chip, wherein the chip is welded in the substrate; a coil is arranged inside the substrate; a first outgoing wire and a second outgoing wire are arranged on the coil; the first outgoing wire is longer than the second outgoing wire; and the first outgoing wire and the second outgoing wire are welded with the chip respectively. Through the technical scheme, the smart card can precisely measure the welding spot tensions of the outgoing wires of the chip in the production process, so that the quality abnormality of a welding spot can be found as early as possible; the production process is effectively simplified, so that the production efficiency is improved; and the unqualified rate of products is reduced.

Description

technical field [0001] The invention relates to the technical field of radio frequency identification, in particular to a smart card capable of measuring the tensile value of solder joints and a method for measuring the tensile value of solder joints. Background technique [0002] Smart cards are becoming more and more popular, and people are increasingly inseparable from various smart cards in their lives. In the production process of smart cards, especially the production of dual-interface cards, one of the difficulties is how to control the quality of the solder joints of the lead-out lines; Control, that is, after the finished card is made, the solder joints are tested through the reliability test, but at this time the card has been produced, if it is found that the reliability test fails due to the quality of the solder joints, the entire batch of products will be scrapped, causing Great loss to the enterprise, as well as affecting the customer's delivery time, etc. A...

AI Technical Summary

Problems solved by technology

In the production process of smart cards, especially the production of dual-interface cards, one of the difficulties is how to control the quality of the solder joints of the lead-out lines; Control, that is, after the finished card is made, the solder joints are tested through the reliability test, but at this time the card has been produced, if it is found that the reliability test fails due to the quality of the solder joints, the entire batch of products will be scrapped, causing Huge loss to the enterprise, and impact on the customer's delivery time, etc.

After analyzing the production process of the smart card in the prior art, it is found that the existing problems of the smart card in the prior art are mainly: the quality of the solder joint cannot be detected in real time after the chip and the lead wire are welded; If a wire is broken, the tensile test will be terminated and the current tensile test value will be recorded, so that the tensile value of the two solder joints cannot be accurately measured during the test, and only one tensile test can be performed to obtain an average value.

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