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Circuit connecting material, circuit connecting structure and circuit element connecting method

A technology for circuit connection materials and circuit components, which is applied in the direction of conductive adhesive connection, electrical component assembly of printed circuits, etc., can solve problems such as short circuit and electrical connection terminal short circuit, reduce the probability of short circuit, and improve the effect of short circuit phenomenon

Inactive Publication Date: 2013-11-13
AU OPTRONICS (XIAMEN) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that the circuit connection structure using the existing conductive adhesive layer is prone to short circuit of the electrical connection end in the prior art, it is necessary to provide a circuit connection material that has a simple structure and can effectively avoid the short circuit of the electrical connection end of the circuit connection structure.

Method used

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  • Circuit connecting material, circuit connecting structure and circuit element connecting method
  • Circuit connecting material, circuit connecting structure and circuit element connecting method
  • Circuit connecting material, circuit connecting structure and circuit element connecting method

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Embodiment Construction

[0023] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, the circuit connection material, circuit connection structure and circuit element connection method proposed according to the present invention will be specifically implemented below in conjunction with the accompanying drawings and preferred embodiments. Ways, methods, steps and effects are described in detail below.

[0024] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. Through the description of specific implementation methods, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the attached drawings are only for reference and description, and are not used to explain th...

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Abstract

The invention provides a circuit connecting material, a circuit connecting structure and a circuit element connecting method, wherein the circuit connecting structure can utilize the circuit connecting material. The circuit connecting material comprises an electric conduction rubber layer and a plurality of insulating protruding blocks which are arranged at intervals and are at least arranged on one surface of the electric conduction rubber layer. When the circuit connecting material is applied to the circuit connecting structure, the insulating protruding blocks and gaps among a plurality of electric connecting terminals of one circuit element of the circuit connecting structure are correspondingly arranged. Therefore, the short circuit phenomenon of an electric connection end of the circuit connecting structure utilizing the circuit connecting material and the circuit element connecting method cannot happen easily.

Description

technical field [0001] The present invention relates to a circuit connection material, a circuit connection structure to which the circuit connection material can be applied, and a circuit element connection method of the circuit connection structure. Background technique [0002] Conductive adhesive is a circuit connection material used to electrically connect the electrical connection ends of two opposite circuit components. For example, currently widely used flat panel displays, such as liquid crystal displays, must be connected with a driver chip and a control circuit on the periphery of the liquid crystal panel to realize the driving of the panel and the input control of display signals. Therefore, conductive adhesives, especially anisotropic conductive adhesive layers, are mainly used for TCP (Tape Carrier Package) or COF (Chip On Flex) with drive components and display panels, or TCP or COF and printed circuit boards, or integrated circuits The electrical connection ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32H01R4/04
Inventor 林佳丽
Owner AU OPTRONICS (XIAMEN) CORP
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