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Embedded device batch upgrading method and system

A technology for embedded equipment and batch upgrade

Inactive Publication Date: 2014-01-15
SHENZHEN GONGJIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention overcomes the fact that it is obviously unrealistic for manufacturers to manually upgrade one by one in order to update all embedded devices, which not only wastes labor costs, but more importantly, cannot meet the requirements of enterprises in terms of production efficiency. A method and system for batch upgrading embedded devices are provided

Method used

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  • Embedded device batch upgrading method and system
  • Embedded device batch upgrading method and system
  • Embedded device batch upgrading method and system

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Embodiment 1. This embodiment provides a system for batch upgrading a large number of embedded devices. In this system, the software to be upgraded is stored in a data server, and the embedded devices to be upgraded pass through the switch and the data server in turn. connected, such as figure 1 shown. The software to be upgraded is processed in the data server, and a group of data packets are formed and sent continuously and cyclically through the switch through a specific multicast address. After the embedded device to be upgraded through the switch is pulled into the switch, it is turned on for guidance. When the boot communication interface is completed, it will start to receive the data packets issued by the data server. After all the data packets are combined and unpacked, the divided data packets will be combined into an upgrade according to the reverse process of the data server packaging. The data file is then burned into the Flash to complete the upgrade.

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Abstract

The invention provides an embedded device batch upgrading method and system. The embedded device batch upgrading method includes the step of adopting a server to continuously transmit related upgrading data packets to the to-be-upgraded embedded devices. The embedded device batch upgrading system is specially used for carrying out software upgrading on embedded devices, the upgrading data server continuously and circularly transmits the upgrading packets to the to-be-upgraded embedded devices having access to the system, and after having access to the system, the to-be-upgraded embedded devices receive complete upgrading data to complete upgrading. The method and system are wide in application platform and convenient to implement, have the remarkable effects in the aspects of improving device production of factory enterprises and the repairing efficiency, saving manpower and material resources and controlling cost, have the good application effect under the background that a user does not have corresponding professional knowledge, and are suitable for being promoted in enterprises where the intelligent embedded devices are produced and maintained.

Description

technical field [0001] The invention relates to the field of methods for upgrading software systems of embedded devices, in particular to a method and system for batch upgrading embedded devices during mass production of embedded devices. Background technique [0002] With the continuous development and growth of some companies that manufacture embedded devices, the scale of product shipments will also increase day by day. Due to various reasons in various aspects, these companies may have to update the software of a large number of devices every day. Such as reworked equipment, after inspection and troubleshooting, the equipment software needs to be updated to the specified version before repackaging and leaving the factory; or some finished products in the warehouse that need to be upgraded to the latest software according to customer requirements. Faced with these hundreds or even thousands of devices, it is obviously unrealistic to manually upgrade one by one by manpowe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/445
Inventor 黎海文郭小东黄铮张炜王志波
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD
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