Filling and sealing method of mini-type missile-borne remote measuring device

Abstract

The invention discloses a filling and sealing method of a mini-type missile-borne remote measuring device. The method comprises the following steps that a, firstly a filling and sealing device of the following structure is obtained, wherein the filling and sealing device comprises a material filling container, a material sucking pipe, a negative pressure device and a transparent air sucking pipe; b, tool assembly and sealing are finished; c, vacuum pumping is carried out to detect the air impermeability; d, vacuum is adjusted to carry out pouring; e, assembly is finished after solidification. The method has the advantages of being simple, easy to implement, low in cost and stable in quality of a filled and sealed body, and can improve the filling and sealing quality, improve the assembly quality of products, ensure good performance of the products and be especially suitable for products with higher requirements for the filling and sealing quality.

Description

technical field [0001] The invention belongs to the field of assembly of miniature missile-borne telemetry devices, and in particular relates to a potting method for miniature missile-borne telemetry devices. [0002] Background technique [0003] The miniature bomb-borne telemetry device is a component loaded on the miniature bomb, which is used to transmit the measured values ​​of some parameters during the operation of the miniature bomb to the launch point to realize long-distance monitoring and remote control. [0004] An existing miniature missile-borne telemetry device has a structure including a cylindrical shell, inside which are installed multiple functional modules such as a battery, a power supply board, a data acquisition modulation board, a frequency conversion board, and a filter board, etc. As a whole, the two ends of the housing are provided with a top cover and a bottom cover, the top cover has through holes, and the signal lines of the functional modules ...

AI Technical Summary

Problems solved by technology

The problems of this kind of potting are: (1) the cost is high, mainly reflected in the mold design and manufacturing; (2) the potting is difficult, because there are many functional modules of the miniature bomb-borne telemetry device, the gap is only a few millimeters, and the potting is difficult. Sealing is easy to cause deformation of the position of each functional component, which affects the performance of the final product; (3) The quality of the potting is unstable. Due to the narrow space of the potting part, the air resistance is relatively large when the potting compound is injected, resulting in a slower flow rate of the potting compound. slow, causing the potting compound to fail to reach the gaps between the functional modules after it begins to gel, and the air bubbles in the potting compound cannot be effectively discharged, resulting in the potting compound not being able to fill the gaps between the functional modules, and voids are prone to appear Phenomenon

[0006] Therefore, there is the defect that the potting quality cannot be guaranteed in this existing potting method.

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