Manufacturing method of light-emitting diode-based light-emitting device

Abstract

The invention relates to a manufacturing method of a light-emitting diode-based light-emitting device. The manufacturing method comprises the following steps: step one, providing an optical element containing grooves; step 2, filling the grooves of the optical element with transparent adhesive materials; step three, providing a light source with light-emitting diodes; and step four, embedding the light-emitting diodes of the light source into the grooves of the optical element and exhausting air between the light-emitting diodes and the transparent adhesive materials. With the manufacturing method, a total reflection phenomenon that is caused during the process of light incidence to the optical element from the light-emitting diode light source can be reduced, so that the light energy loss can be minimized and the light utilization efficiency of the light-emitting device can be improved.

Description

technical field [0001] The invention relates to a method for manufacturing a light emitting device, in particular to a method for manufacturing a light emitting device with a light emitting diode light source. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] In the production of existing light emitting devices, light emitting diodes and light guide plates are usually used to construct light emitting diode light emitting devices. The light guide plate includes a light incident surface, and the light emitting diodes are opposite to the light incident surface of the light guide plate and arranged at intervals. The light-emitting diode generally inclu...

AI Technical Summary

Problems solved by technology

When the light emitted by the light-emitting diode chip is transmitted through the package and directed to the light incident surface of the light guide plate, when the light is emitted from the light-emitting surface of the package to the air outside the package, the light is transmitted from the optically denser medium to the optically thinner medium. Therefore, part of the light that reaches the interface between the light-emitting surface of the package body and the air will produce total reflection, so that the light emitted by the LED chip cannot be completely emitted and enters the interior of the light guide plate, resulting in loss of light energy

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