Method for synthesizing imide group modified low-molecular-weight line-type phenolic resin and sensitization imaging composition containing imide group modified low-molecular-weight line-type phenolic resin

A novolac resin and imaging composition technology, applied in the field of photosensitive materials, can solve the problems of not reducing other properties of the plate material, loss of ink affinity of the plate material, decline of ink affinity of the plate material, etc., to achieve high alcohol resistance, Excellent alcohol resistance, performance improvement effect

Inactive Publication Date: 2015-04-22
威海经济技术开发区天成化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method has achieved certain effects, there are still some shortcomings: first, because many carboxyl groups are introduced, the ink affinity of the photosensitive imaging composition system is greatly affected. When acrylic resins were used in the past, the content of acrylic acid When it is 30%, the ink affinity of the plate material is greatly reduced, and when it is greater than 50%, the ink affinity of the plate material is almost completely lost. This problem also exists with the resin of the ester carboxylic acid system
[0004] All in all, whether it is using modified phenolic resin, namely ester carboxylic acid resin or adding low molecular weight additives, these methods have some shortcomings more or less, and they cannot increase the sensitivity of the plate without reducing the other properties of the plate. performance

Method used

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  • Method for synthesizing imide group modified low-molecular-weight line-type phenolic resin and sensitization imaging composition containing imide group modified low-molecular-weight line-type phenolic resin
  • Method for synthesizing imide group modified low-molecular-weight line-type phenolic resin and sensitization imaging composition containing imide group modified low-molecular-weight line-type phenolic resin
  • Method for synthesizing imide group modified low-molecular-weight line-type phenolic resin and sensitization imaging composition containing imide group modified low-molecular-weight line-type phenolic resin

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0056] Add 120g of N,N-dimethylformamide and 32.7g (0.3mol) of p-aminophenol into a 250mL three-necked round-bottomed flask equipped with a mechanical stirrer, a thermometer, and a reflux condenser, stir and heat up to 60-70°C and divide 30.2g (0.3mol) of succinic anhydride was added in batches, and the addition was completed within 0.5-1.0h. Then the temperature was raised to 90-95°C within 1.5-2.0h and the reaction was maintained in this temperature range for 1.5-2.0h. Then add 0.87g oxalic acid and 25.2g (0.15mol) of 2,6-DHMP, and gradually raise the temperature to 120°C within 2h, add 0.87g oxalic acid, rise to 140°C within 2h, and rise to 170°C within 1h. At 170°C, start to heat up while decompressing and evacuating, and rise to 200°C within 0.5-1h, and then depressurize and evacuate at 200°C for 15-20min. The resinous black-brown imide-modified low-molecular-weight polycondensate S-1 was obtained after discharging.

Synthetic example 2

[0058] Change 25.2g (0.15mol) of 2,6-DHMP into 33.6g (0.20mol) of 2,6-DHMP in synthetic example 1, the addition of twice oxalic acid is all changed into 1.0g by 0.87g, all the other reactions The conditions and processes were not changed, and the resinous imide group modified low molecular weight condensation polymer S-2 was obtained.

Synthetic example 3

[0060] Change 25.2g (0.15mol) of 2,6-DHMP into 37.8g (0.225mol) of 2,6-DHMP in synthetic example 1, the addition of twice oxalic acid is all changed into 1.05g by 0.87g, all the other reactions The conditions and processes were not changed, and the resinous imide group modified low molecular weight condensation polymer S-3 was obtained.

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Abstract

The invention relates to a method for synthesizing imide group modified low-molecular-weight line-type phenolic resin. The method includes the following steps: in N, N-dimethyl formamide or a mixing solution mainly containing the N, N-dimethyl formamide, paraaminophenol reacts with anhydride in dicarboxylic acid to obtain an amide carboxylic acid phenolic compound; under catalysis of acid catalysts like oxalic acid, the amide carboxylic acid phenolic compound and 2, 6-dihydroxytoluene paracresol have polycondensation and a dehydration ring closing reaction to obtain the imide group modified low-molecular-weight line-type phenolic resin. The invention further comprises a sensitization imaging composition containing the modified phenolic resin. The sensitization imaging composition comprises the modified phenolic resin, film-forming resin, an optical active compound, a background dye and the like; the modified phenolic resin has the excellent alcohol-resisting performance, an alkali developing solution has the high dissolution-promotion performance, and therefore an obtained board has the high alcohol-resisting performance, the high sensitivity and the high resolution ratio.

Description

technical field [0001] The invention belongs to the field of photosensitive materials, and more specifically, relates to a photosensitive imaging composition for a high-sensitivity positive PS plate and a UV-CTP plate, especially a method for synthesizing an imide-modified low-molecular-weight novolac resin and A photosensitive imaging composition comprising the resin. Background technique [0002] In the past, in order to improve the sensitivity of positive PS plates and UV-CTP plates, ester carboxylic acid system resins were often used, that is, some phenolic hydroxyl groups of phenolic resins were esterified and some carboxyl groups were introduced. The inventors of the present invention synthesized a series of modified phenolic resins containing ketone carbonyl, ester carbonyl and carboxyl carbonyl around 2006. These modified phenolic resins contain at least one of the aforementioned carbonyl groups, the most widely used, the best effect and the most convenient synthesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D207/404C07D209/48C07D209/76G03F7/004
CPCC07D207/408C07D209/48C07D209/76G03F7/0045
Inventor 余尚先丛军成丛培军杨金瑞邵正春王大伟
Owner 威海经济技术开发区天成化工有限公司
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