Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-partition based MCU chip information protection method and device

An information protection and chip technology, applied in the direction of program/content distribution protection, computer security device, internal/peripheral computer component protection, etc., can solve problems such as inability to prevent mutual theft and inability to satisfy

Active Publication Date: 2015-04-29
GIGADEVICE SEMICON (BEIJING) INC
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of information protection schemes, MCU chip products currently on the market only protect the contents of the flash memory user area as a whole, which cannot meet the needs of multiple companies to jointly develop programs
Because it can only protect the content of the flash user area from being stolen by customers, but it cannot prevent companies that jointly develop programs from stealing each other's programs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-partition based MCU chip information protection method and device
  • Multi-partition based MCU chip information protection method and device
  • Multi-partition based MCU chip information protection method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0051] An information protection scheme of an MCU chip according to an embodiment of the present invention is introduced below.

[0052] The read protection level of the flash memory controller is controlled by several control bits in the information area of ​​the flash memory. The read protection level of the flash memory controller is divided into three levels, and the characteristics of each level are as follows:

[0053] Zero-level read protection: The user area of ​​the flash memory is completely open and can be read, written and erased arbitrarily. The flash information area is also completely open.

[0054] Level-1 read protection: booting from the flash user area can normally access the flash user area; other boot method...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides multi-partition based MCU chip information protection method and device. An MCU chip comprises an instruction bus, a data bus, a flash memory controller and a flash user area. The method comprises the steps of determining the accessed prior partition when the instruction bus accesses the flash user area; entering the prior partition working state corresponding to the prior partition; determining the accessed current partition when the instruction bus accesses the flash user area; entering a transition state in case that the prior area is different from the current partition; determining whether the time under the transition state reaches the preset waiting time; if so, entering the partition working state corresponding to the current partition. With the adoption of the method and device, programs can be protected from being stolen by a user, and meanwhile, the companies cooperating to develop the programs cannot steal programs from each other.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to an MCU chip information protection method based on several partitions and an MCU chip information protection device based on several partitions. Background technique [0002] With the continuous improvement of integrated circuit technology, MCU (Micro Control Unit, Micro Control Unit) chips are more and more widely used, ranging from small children's toys to large construction machinery, all need to use MCU chips. The MCU chip usually includes a CPU (Central Processing Unit, central processing unit), a flash memory (Flash Memory), an SRAM (Static Random Access Memory, static random access memory) and various peripheral devices. When the MCU chip is powered off, the content of the flash memory will not be lost, but the content of the SRAM will be lost. The flash memory is usually divided into two independent areas: one is the flash user area, which is used to store us...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F21/12
CPCG06F21/123G06F21/1011G06F12/1433G06F12/1441G06F12/1491G06F21/53G06F21/78G06F2212/1052G06F2212/214G06F2212/7202G06F3/0622G06F3/0644G06F3/0679G06F13/4022G06F13/4282G06F12/14G06F3/062G06F2221/2113G06F21/85G06F2213/0026
Inventor 李宝魁王景华王南飞
Owner GIGADEVICE SEMICON (BEIJING) INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com