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Electronic equipment

A technology of electronic equipment and heat pipe, which is applied in the electronic field, can solve the problem of high shell temperature, and achieve the effect of lowering the shell temperature, reducing heat, and retaining heat transfer performance

Active Publication Date: 2015-05-20
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present application provides an electronic device, which solves the technical problem in the prior art that a heat pipe is arranged in the housing to conduct heat, and the temperature of the housing close to the heat pipe is relatively high.

Method used

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Embodiment 1

[0046] An electronic device is provided in Embodiment 1. In practical applications, the electronic device may be an electronic device such as a notebook or a tablet computer, which will not be listed one by one in this embodiment.

[0047] Please refer to figure 1 , figure 1 It is a schematic diagram of the electronic equipment in Embodiment 1 of the present application, and the electronic equipment includes:

[0048] A housing 101, the housing 101 comprising an inner surface 102;

[0049] The heat pipe 103 is arranged inside the casing 101 for transferring heat, and the first section 104 of the heat pipe 103 is arranged on the first side of the casing 101 close to the inner surface 102;

[0050] Wherein, the sidewall of the first segment 104 is sunken to form a first groove 105 , and the bottom surface of the first groove is opposite to the inner surface 102 .

[0051] Next, the positional relationship of the heat pipe 103 in the housing 101 , the position of the first secti...

Embodiment 2

[0082] An electronic device is provided in Embodiment 2. In practical applications, the electronic device may be a notebook, a tablet computer and other electronic devices, which will not be listed one by one in this embodiment.

[0083] The electronic equipment includes:

[0084] a housing including an inner surface;

[0085] A heat pipe is arranged inside the casing for transferring heat, and a first section of the heat pipe is arranged on a first side of the casing close to the inner surface;

[0086] Wherein, the side wall of the first section is sunken to form a first groove, and the bottom surface of the first groove is opposite to the inner surface.

[0087] Please refer to Figure 8 , Figure 8 It is a schematic diagram of the heat pipe in Embodiment 2 of the present application.

[0088] In this embodiment, the heat pipe also includes:

[0089] The second segment 801 connected to the first segment 104 is arranged on the first side, and the side wall of the second...

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Abstract

The invention discloses electronic equipment. The electronic equipment comprises a shell and a heat tube, wherein the shell comprises an inner surface; the heat tube is arranged in the shell and is used for transferring heat; a first section of the heat tube is arranged on a first side, which is close to the inner surface, of the inside of the shell; the side wall of the first section is recessed to form a first groove; and the bottom of the first groove is opposite to the inner surface. By the electronic equipment, the technical problems that in the prior art, a heat tube is arranged in a shell and is used for transferring heat, and the temperature of a portion, which is close to the heat tube, of the shell is high are solved. The technical effect of reducing the temperature of the portion, which is close to the heat tube, of the shell is achieved.

Description

technical field [0001] The present invention relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] At present, various electronic products on the market, including: desktop computers, all-in-one computers, notebook computers, etc., are developing towards the trend of higher performance and smaller volume and thickness, while high performance, small size , Thin thickness will inevitably lead to a large amount of heat generated inside the electronic product when it is working, and the heat will gather tightly. If the heat accumulates to a certain extent, it will burn out various devices (such as CPU) inside the electronic product, causing the electronic product to fail to work. , in order to control the temperature range inside the electronic product to ensure the stable operation of the electronic product, a heat pipe will be set inside the electronic device to transfer the heat of the high-heat components inside t...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
Inventor 田婷
Owner LENOVO (BEIJING) CO LTD
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