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An ltcc slot coupled array antenna

A coupling array and slot technology, which is applied to antennas, antenna arrays, antenna grounding devices, etc., can solve the problems of increasing the thickness or area of ​​the antenna, which is not conducive to the development needs of the miniaturization of the conformal design of the microstrip patch antenna and the carrier, etc. Achieve the effect of improving stability and reliability, increasing bandwidth, and compact arrangement

Inactive Publication Date: 2017-12-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods are at the expense of increasing the thickness or area of ​​the antenna, which is not conducive to the conformal design of the microstrip patch antenna and the carrier and the development needs of miniaturization
The contradiction between miniaturization, broadband and high-gain development of microstrip patch antenna has not been well resolved

Method used

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  • An ltcc slot coupled array antenna
  • An ltcc slot coupled array antenna
  • An ltcc slot coupled array antenna

Examples

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Embodiment

[0028] This embodiment provides a LTCC slot-coupled broadband high-gain microstrip array antenna with a center frequency of 10 GHz, and its structure is as follows Figure 1 to Figure 5 As shown, it mainly includes:

[0029] The upper dielectric substrate 1 is made of 15 sheets of LTCC cast film with a thickness of 0.1mm and a dielectric constant of 5.9. The upper surface is printed with silver paste and has 64 upper-layer radiation metals arranged in a triangular grid. SMT unit 2;

[0030] The middle dielectric substrate 3 is made of 15 LTCC cast film sheets with a thickness of 0.1mm and a dielectric constant of 5.9, and its upper surface is 64 lower radiation metal patch units arranged in a rectangular grid 4 ;

[0031] The lower dielectric substrate 8 is formed by stacking five LTCC cast film sheets with a thickness of 0.1mm and a dielectric constant of 5.9. The paste is printed with a grounded metal layer 6, and 64 resonant slots 5 are opened on the grounded metal layer ...

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Abstract

The invention provides a slot-coupled array antenna, which belongs to the technical field of antennas. The purpose of the present invention is to overcome the shortcomings of the existing microstrip array antenna in terms of miniaturization, broadband and high gain. The antenna includes upper and lower radiating metal patch units, upper, middle and lower dielectric substrates, grounding metal layers, Resonant slot and microstrip feed network, the radiating metal patch units of the upper layer are arranged in a triangular grid, and the radiating metal patch units of the lower layer are arranged in a rectangular grid. Compared with conventional microstrip patch array antennas based on organic media or ceramic substrates, the present invention can obtain wider antenna bandwidth under the same size limitation, and better balance the performance requirements of patch antenna miniaturization, broadband and high gain .

Description

technical field [0001] The invention belongs to the technical field of antennas, in particular to an LTCC wide-band high-gain array antenna. Background technique [0002] Microstrip patch antenna has many advantages such as small size, light weight, thin profile, easy conformal, etc. It is widely used in radar, missile measurement and control, satellite positioning, wireless communication, remote sensing, aerospace and other fields. In airborne or missile-borne applications, the performance requirements of microstrip array antennas are particularly emphasized for their miniaturization, wide frequency band and high gain. However, the input impedance of the microstrip patch antenna is very sensitive to changes with frequency, resulting in a narrow impedance bandwidth. The current microstrip patch antennas generally use organic dielectric materials or ceramic materials as substrates. In order to expand the bandwidth of microstrip patch antennas, common methods include increasi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/48H01Q1/50H01Q21/00
Inventor 张怀武李贵栋李丽君郝欣欣段耀铎刘小飞
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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