Fingerprint identification sensing apparatus and manufacturing method thereof, and terminal device

Abstract

The invention provides a fingerprint identification sensing apparatus and a manufacturing method thereof, and a terminal device. The fingerprint identification sensing apparatus comprises: a substrate which comprises a first surface and a second surface opposite to the first surface, wherein the first surface of the substrate is provided with a groove; a first conductor layer disposed on the bottom surface of the groove; a protective layer which is disposed in the groove and covers the first conductor layer; a second conductor layer disposed on the second surface, wherein the first conductor layer and the second conductor layer form two electrodes of a capacitor for transmitting radiofrequency signals; and a radiofrequency field induction module disposed at one side of the second surface of the substrate. According to the invention, the problem in the prior art that fingerprint identification is realized by arranging through holes and the problem that a part of a conductive material, higher than a transparent cover plate, is easily worn and corroded during application can be solved.

Description

technical field [0001] The invention relates to the field of touch technology, in particular to a fingerprint identification sensing device, a manufacturing method thereof, and a terminal device. Background technique [0002] In existing terminal equipment, the introduction of RFID (Radio Frequency Identification, radio frequency identification) technology provides a new option for realizing fingerprint identification. For example, a terminal device in the prior art makes a metal ring penetrating through a transparent cover around a physical key, so that a radio frequency signal can be transmitted to a finger touching the key through the metal ring. Thus, the finger constitutes one pole of the capacitor, and the sensor array at the bottom of the key constitutes the other pole of the capacitor, so the distance between the finger surface and the sensor array will vary with the unevenness of the finger surface in various places. Different distances cause different electric fie...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the defects in the prior art, the present invention provides a fingerprint identification sensing device and its manufacturing method, and terminal equipment, which can solve the problem in the prior art that a through hole needs to be opened to realize fingerprint identification and the part higher than the transparent cover plate The problem that conductive materials are easily worn or corroded in use

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