Novel pressure welding system

A new type of welding head technology, applied in pressure electrodes, electrode features, etc., can solve the problems of increased production costs, high workpiece scrap rate, waste of production materials, etc., to reduce maintenance costs, prevent damage, and reduce impact forces. Effect

Active Publication Date: 2017-06-13
ZHEJIANG IND POLYTECHNIC COLLEGE
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  • Application Information

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Problems solved by technology

However, in the process of use, it was found that since the pressure welding uses the welding head for stamping welding, and the thickness of the circuit board is small, it is easy to deform and break when the welding point is under pressure, resulting in damage to the circuit board and the scrap rate of the workpiece is too high. High, which greatly increases the production cost and causes waste of production materials

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention.

[0029] Such as Figure 1-13 As shown, a new type of pressure welding system includes a cleaning unit 1 for removing debris on the surface of a workpiece and a pressure welding unit 2 for performing pressure welding operations on the workpiece. The pressure welding unit 2 includes a frame 21, The worktable 22, the pressure welding power arm 23, the pressure welding assembly, the heating structure, and the first driving part 25 are arranged on the frame; the pressure welding power arm 23 can move up and down along the frame, the first driving part 25 It is a rodless cylinder; in order to prevent the pressure welding power arm 23 from shifting during the up and down movement,...

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Abstract

The invention discloses a novel pressure welding system. The novel pressure welding system comprises a cleaning unit for cleaning impurities on surfaces of to-be-machined workpieces and a pressure welding unit for performing pressure welding operation on the workpieces, wherein the pressure welding unit comprises a rack, a workbench arranged on the rack, a pressure welding power arm capable of acting along the rack up and down, a pressure welding assembly connected with the pressure welding power arm, a heating structure for heating the pressure welding assembly as well as a first drive part for driving the pressure welding power arm to act up and down; the pressure welding assembly comprises a pressure welding head and a pressure dispersion part connected to the pressure welding power arm through an elastic part, and in the initial state, the pressure dispersion part is located below a pressure welding head and above the workbench. The novel pressure welding system can effectively disperse pressure applied by the pressure welding head to the workpieces, prevent workpiece deformation or damage caused by over-high pressure on to-be-welded positions and reduce the scrap rate of the workpieces; the pressure welding position is accurate and the welding quality and efficiency are improved.

Description

Technical field [0001] The invention belongs to the technical field of welding equipment, and particularly relates to a new type of pressure welding system. Background technique [0002] In the current circuit board production process, when welding the pads and leads in the circuit board, manual welding is usually adopted, which has low welding efficiency and insufficient welding effect. In order to ensure the accuracy and firmness of the welding of the two, various welding equipment has appeared in the prior art to weld the pads and leads in the circuit board. The welding effect and efficiency have been significantly improved, and the pressure welding effect is the best. , Fast welding speed and precise welding position. However, during use, it was found that because the pressure welding uses welding heads for stamping and welding, and the thickness of the circuit board is small, it is easy to deform and break when the welding point is under pressure, which causes the circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K11/30
CPCB23K11/3009
Inventor 赵巧良范里洪
Owner ZHEJIANG IND POLYTECHNIC COLLEGE
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