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Gaming headset with adjustable contact pressure

A headphone and contact pressure technology, which is applied in the fields of on-ear/around-ear earphones, stereo communication earphones, earphone manufacturing/assembly, etc. It can solve low acoustics, discomfort, and difficulties in evenly distributing contact pressure across ear parts and other issues, to achieve the effect of safety adjustment, safety and comfort increase

Active Publication Date: 2017-12-08
SENNHEISER COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] A disadvantage of the mentioned methods and the adjustable stiffness headband is that they require a relatively large and bulky spring mechanism, which hinders the aesthetics of the headset and significantly reduces user comfort
[0010] Also, due to the necessity for relative movement between the moving parts of the spring mechanism for adjustment, the aforementioned headsets are susceptible to injury and failure caused by, for example, hair, fingers, or other objects interfering with the movement of the spring mechanism during adjustment.
[0011] Additionally, there are additional challenges in evenly distributing the contact pressure across the lugs
Uncomfortable and poor acoustics due to twisting of the headset due to force exerted by the spring mechanism

Method used

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  • Gaming headset with adjustable contact pressure
  • Gaming headset with adjustable contact pressure
  • Gaming headset with adjustable contact pressure

Examples

Experimental program
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Effect test

Embodiment Construction

[0056] figure 1 A possible layout of a typical headset 100 is shown. The headset 100 includes two earpieces 120 connected by a headband structure 110 . Through the earpiece 120, acoustic signals such as music, speech, sound, etc. are delivered to the user's ears. Depending on the stiffness of the headgear structure 110, a contact pressure 130 is exerted on the user's ear. Likewise, the headset 100 may only include one earpiece 120 . Contact pressure 130 is effective between the ear pieces 120 or between the left and right end points of the headgear structure 110 .

[0057] The headset 100 shown represents the state of the art without the functional feature of adjusting the stiffness of the headband structure 110 and thus the contact pressure 130 according to the invention. The headset 100 also includes a microphone 140, however, it is not necessary for the headset 100 to include such a microphone for the scope of the present invention.

[0058] The headset 100 may also in...

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Abstract

The invention relates to a headset comprising at least one headband and at least one earpiece, the headband comprising a headband structure, wherein the headband structure is divided in at least one soft, flexible section and at least one stiff, non-flexible section, at least one sliding spring element, at least one handle element attached to the at least one sliding spring element and at least one guiding element, guiding the relative movement between the headband structure and the at least one sliding spring element.

Description

technical field [0001] The invention relates to headphones with adjustable contact pressure. In addition to the often super comfortable nature of a headset with adjustable headband stiffness, aesthetics and functionality are also important to the user. Background technique [0002] Headphones having means for adjusting the stiffness of the headband are known. Such headsets typically feature the ability to selectively adjust the contact pressure that the earpieces exert on the user's head through an appropriate spring mechanism. By adjusting the contact pressure to an appropriate and personal level, the user can ensure an optimum level of comfort and acoustic properties, especially when wearing the headset for an extended period of time, for example for several hours. [0003] US 6,333,982 B1 discloses headphones comprising a headband connected to at least one earphone by a manually settable high torque resistant pivot. In another aspect of the invention, a headset include...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1066H04R5/0335H04M1/05H04R1/1008H04R1/1058H04R5/033H04R19/04H04R2201/109
Inventor L·E·奈加得A·杰森K·S·伊普森P·V·瓦鲁姆
Owner SENNHEISER COMM
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