Device for splicing and recreating circuit board

A circuit board and platform technology, applied in the field of circuit board splicing and remanufacturing devices, can solve problems such as high labor intensity of workers, hidden dangers of product quality, and eye fatigue, so as to reduce human injury factors, improve quality assurance, and reduce eye intensity. Effect

Pending Publication Date: 2018-03-30
苏州轩明视测控科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this manual comparison and jigsaw method has been used for many years, there are still some problems as follows: 1. Using manual comparison is inefficient and the production capacity is low, only 40pcs / hour; 2. The labor intensity of workers is high and requires Personnel keep manual adjustments; long-term operation, workers overuse their eyes, resulting in eye fatigue, and there are hidden dangers of industrial injury to the human body; 3. Stitching accuracy cannot guarantee its stability, and there are hidden dangers in product quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for splicing and recreating circuit board
  • Device for splicing and recreating circuit board
  • Device for splicing and recreating circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0023] see Figure 1 to Figure 4 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a device for splicing and recreating a circuit board. The device comprises a frame, an operation platform, a CCD vision system, a circuit board splicing movement module and a displacement mechanism. The operation platform is arranged on the frame. The circuit board splicing movement module comprises a fixed support platform and an adjustable splicing platform. The displacement mechanism includes an X-axis moving sliding rail and a Y-axis moving sliding rail. The CCD vision system is arranged on X-axis moving sliding rail and moves back and forth along the X-axis moving sliding rail. The device is mainly applicable to the circuit board processing and production industry, the splicing position of the circuit board can be automatically adjusted according to measurementinformation, and problems of low efficiency, unstable quality and potential human injury caused by a current manual operation mode can be solved well.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing and production, and relates to a splicing and rebuilding device for circuit boards. Background technique [0002] After the circuit board is designed, it is necessary to paste components on the SMT assembly line. The SMT processing factory will specify the most suitable size of the circuit board according to the processing requirements of the assembly line production equipment. If the size of the circuit board is too small or too large, it will not be able to Follow up production. [0003] When the size of the circuit board required by the electronic product design is smaller than the size specified by the factory, we need to assemble several circuit boards into a whole piece to meet the production conditions of the factory. [0004] The jigsaw operation mode is relatively popular at present, and it has been included in the designer's consideration in the design stage. However, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K3/00
CPCH05K3/0008H05K3/36H05K2203/166
Inventor 刘金平李强张炼彬张雨涛陈高磊蔡春远张超
Owner 苏州轩明视测控科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products