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Middle frame assembly, middle frame assembly processing method and electronic device

A technology of electronic device and processing method, which is applied in the direction of electrical equipment shell/cabinet/drawer, circuit, telephone communication, etc., can solve the problems of difficult connection of structural parts, occupying space and other problems, and achieve the effect of saving space and reliable connection

Inactive Publication Date: 2018-06-22
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, riveting is generally done by means of rivets. Through holes are processed on the middle frame and the bearing plate respectively, and the middle frame and the bearing plate are fixedly connected by rivets. However, since the rivets need to occupy space, therefore, Make it more difficult to connect structural parts in a narrow space

Method used

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  • Middle frame assembly, middle frame assembly processing method and electronic device
  • Middle frame assembly, middle frame assembly processing method and electronic device
  • Middle frame assembly, middle frame assembly processing method and electronic device

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the accompanying drawings in the embodiments of the application. Apparently, the described embodiments are only part of the embodiments of the application, not all of them. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0024] see figure 1 , figure 1 It is a schematic structural diagram of a middle frame assembly provided in Embodiment 1 of the present application. The middle frame assembly 10 is applied to the electronic device 1 . In one embodiment, the middle frame assembly 10 includes a middle frame 100 and a carrier board 200 . The middle frame 100 and the carrier board 200 are described in detail as follows.

[0025] The middle frame 100 includes a frame b...

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Abstract

The invention provides a middle frame assembly, a middle frame assembly processing method and an electronic device. The middle frame assembly is applied to the electronic device, and comprises a middle frame and a loading plate, wherein the middle frame comprises a frame body; the frame body comprises a first surface and a second surface arranged oppositely; at least one first through hole penetrating through the first surface and the second surface is formed in the frame body; the loading plate is used for installing a functional device of the electronic device, and comprises a loading body and at least one first extending part; the loading body comprises a third surface and a fourth surface arranged oppositely; the first extending part extends from the third surface; the first extendingpart and the first through hole are in interference fit; and the first surface and the third surface are arranged in a fitting way. According to the middle frame assembly, the middle frame assembly processing method and the electronic device provided by the invention, the middle frame and the loading plate are easily connected in a narrow space.

Description

technical field [0001] The present application relates to the field of mechanical technology, and in particular to a middle frame assembly, a processing method for the middle frame assembly, and an electronic device. Background technique [0002] The middle frame assembly generally includes a middle frame and a bearing plate. The middle frame includes a plurality of segmented frames arranged on the edge of the carrier plate, and antenna slots are formed between the end surfaces of two adjacent segmented frames. The segmented frame and the bearing plate are fixed by a riveting process, and the bearing plate is provided with a clearance area connected to the antenna slit for the antenna to radiate electromagnetic wave signals. In the prior art, riveting is generally done by means of rivets. Through holes are processed on the middle frame and the bearing plate respectively, and the middle frame and the bearing plate are fixedly connected by rivets. However, since the rivets nee...

Claims

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Application Information

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IPC IPC(8): B21D39/00
CPCB23P15/00H05K7/18H05K7/14H01Q1/243H04M1/0202H04M1/0277H01Q13/106B23P11/02H05K5/0017H05K5/0217
Inventor 黄富勇
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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