Pixel cell and method for forming same and digital camera imaging system

A pixel unit and image signal technology, applied in the field of image sensors, can solve problems such as spatial deformation

Active Publication Date: 2018-06-22
思特威(上海)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a risk of spatial distortion when imaging relatively large, fast-moving objects

Method used

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  • Pixel cell and method for forming same and digital camera imaging system
  • Pixel cell and method for forming same and digital camera imaging system
  • Pixel cell and method for forming same and digital camera imaging system

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Embodiment Construction

[0056] The present invention is further illustrated and described in conjunction with the above-mentioned drawings. The present invention is a stacked image sensor pixel unit with charge amplifier and selectable rolling exposure and global exposure readout modes and global exposure readout path intra-pixel correlated double sampling. The present invention presents various embodiments of stacked image sensors. In the following description, numerous details are given for understanding the content of the present invention. Those skilled in the art should know that the technical content described in the present invention can be implemented without specific details or other methods, components, materials and the like. In other instances, known structures, materials or operations are not shown or described in detail to avoid obscuring the specific matter. A substrate can have a front side and a back side. Any machining process performed from the front side can be considered as a ...

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Abstract

A pixel cell has a first substrate, one or more transfer transistors, a reset transistor, a capacitor, an amplifier transistor and a readout circuit block. The photodiode, transfer transistor, reset transistor and the amplifier transistor are disposed within a first substrate of a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode. The readout circuit block may be partially disposed within a second substrate of a second semiconductor chip and partially disposed within the first substrate wherein the readout circuit block comprises optionally selectable rolling shutter and global shutter readout modes through the use of computer programmable digital register settings. The global shutter readout mode provides in-pixel correlated doublesampling.

Description

technical field [0001] The invention relates to an image sensor, in particular to a pixel unit of a CMOS image sensor with a stacked chip structure. The bottom chip includes a photosensitive area and an array of structures to capture images. The top chip includes circuit elements to acquire images from the array. Image sensors can be used in digital cameras. Background technique [0002] An image capture device generally includes an image sensor and a lens. The lens focuses light onto the image sensor to form an image, and the image sensor converts the light signal into an electrical signal. Electrical signals are output from the image capture device to other components of the electronic system. The image capture device and other components of the electronic system make up the image system. Image sensors are becoming more common and can be found in various electronic systems, such as mobile phones, digital cameras, medical equipment, and computers. [0003] A typical i...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H04N5/374H04N5/378H04N5/235H04N5/225
CPCH04N23/54H04N23/70H04N25/76H01L27/14612H01L27/14603H01L27/14641H04N25/531H04N25/778H04N25/79H04N25/77H04N25/616H04N25/771H04N3/1562H04N23/71H04N25/53H04N25/75
Inventor莫要武徐辰邵泽旭张正民
Owner思特威(上海)电子科技股份有限公司