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Heat dissipation device for uniform-temperature plate for LED lamp

A technology of LED lamps and heat dissipation devices, which is applied in the direction of cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc. Achieve uniform heat dissipation and other issues, achieve uniform heat dissipation, safe and reliable use

Inactive Publication Date: 2018-09-14
肇庆市创业帮信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above patents cannot achieve uniform heat dissipation, and it is not convenient for LED lamps to achieve large-area heat dissipation. In addition, if the lamp works for a long time, the heat dissipation effect of the lamp cannot reach the best state

Method used

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  • Heat dissipation device for uniform-temperature plate for LED lamp
  • Heat dissipation device for uniform-temperature plate for LED lamp
  • Heat dissipation device for uniform-temperature plate for LED lamp

Examples

Experimental program
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Embodiment Construction

[0020] The present invention will be further described below in conjunction with accompanying drawing:

[0021] Such as Figure 1-Figure 3 As shown, a vapor chamber heat dissipation device for LED lamps includes a heat dissipation channel tube 7, low heat dissipation fins 9, a vapor chamber 11, and an LED lamp mounting seat 12, and a tube connection seat 6 is provided on one side of the heat dissipation channel tube 7. , the heat dissipation channel pipe 7 is used for the entry of air to realize heat dissipation, the pipe connection seat 6 is used to connect the air intake pipe 5 and the heat dissipation passage pipe 7, an air intake pipe 5 is arranged on one side of the pipe connection seat 6, and the air intake pipe 5 is used for circulating heat dissipation gas, One side of the intake pipe 5 is provided with an intake valve 4, which is used to control the on-off of the intake pipe 5, and one side of the intake valve 4 is provided with an air filter 3, which is used to filte...

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Abstract

The invention discloses a heat dissipation device for a uniform-temperate plate for an LED lamp. The heat dissipation device comprises a heat dissipation channel tube, a low-heat-dissipation fish fin,the uniform-temperature plate and an LED lamp mounting seat, wherein a tube connecting seat is arranged on one side of the heat dissipation channel tube, one side of the tube connecting seat is provided with an air inlet tube, one side of the air inlet tube is provided with an air inlet valve, an air filter is arranged on one side of the air inlet valve, an air blower is arranged on one side of the air filter, the top of the air blower is provided with the air inlet tube, the other side of the heat dissipation channel pipe is provided with a high-heat-dissipation fish fin, and one side of thehigh-heat-dissipation fish fin is provided with the low-heat-dissipation fish fin. The heat dissipation device for the uniform-temperate plate for the LED lamp has the beneficial effects that the heat dissipation fish fins cooperate with the uniform-temperature plate for use, so that the use of the device is safe and reliable, uniform heat dissipation can be achieved, moreover, large-area heat dissipation is facilitated for a long-strip-shaped LED lamp, and the heat dissipation effect can reach the optimal state for a lamp which works for a long time.

Description

technical field [0001] The invention relates to the technical field of heat transfer, in particular to a vapor chamber cooling device for LED lamps. Background technique [0002] The heat in the vapor chamber is conducted on a two-dimensional surface, so it is more efficient. Compared with the Chinese patent application number 201720656524.5, a heat dissipation vapor chamber is disclosed, which includes a hollow vapor chamber body. The upper surface of the vapor chamber body is provided with an upright heat dissipation plate. The heat dissipation plate is an inner hollow structure. The hollow structure of the heat dissipation plate is connected with the hollow structure of the temperature chamber body, and the hollow structure of the heat dissipation plate and the hollow structure of the temperature chamber body are filled with working medium. Due to the existence of the working medium, the heat can be quickly transferred to the vapor chamber body and the heat dissipation p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/67F21V29/83F21V29/74F21V29/89F21V29/51F21Y115/10
CPCF21V29/673F21V29/51F21V29/74F21V29/83F21V29/89F21Y2115/10
Inventor 贺士友
Owner 肇庆市创业帮信息技术有限公司
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