A cooling device for an inertial navigation module

Abstract

The invention discloses a heat dissipation device for an inertial navigation module, belonging to the technical field of fluid heat dissipation, comprising: a microchannel radiator adopting a shower type multi-channel mixed impact heat dissipation structure, a micropump, a liquid outlet pipe, and corresponding to each chip A number of shunt tubes, multi-channel fluid control valves, return chambers and heat dissipation fins arranged on each shunt pipe; there is a thermal conductive coating between the micro-channel radiator and the PCB board of the inertial navigation chip; through the return chamber and heat dissipation fins The heat dissipation working fluid cooled by the chip is pumped out by the micro pump, and enters the multi-channel fluid control valve through the liquid outlet pipe. The multi-channel fluid control valve changes the flow rate of the working fluid in the shunt pipe based on the real-time temperature of the chip, and the cooled heat dissipation working fluid is introduced through the shunt pipe. The micro-channel radiator, after absorbing the heat of the chip, enters the reflow cavity to form a heat dissipation circuit. The invention can realize intelligent heat dissipation for different regions on the inertial navigation module.

Description

technical field [0001] The invention relates to the technical field of fluid heat dissipation, in particular to a heat dissipation device for an inertial navigation module. Background technique [0002] Gyroscope (also known as angular motion detector) is an instrument that uses the conservation of angular momentum to obtain the precise orientation of moving objects. It is an inertial navigation spare part widely used in modern aerospace and defense industries. It is used in modern drones. Or anti-drone flight control system is widely used, has very important strategic significance. Generally speaking, inertial navigation components such as gyroscopes and accelerometers will be packaged on the same PCB board with other types of chips, such as high-performance LDO power chips, high-performance Cortex-Mo core processors, and highly integrated MEMS sensor chips. Made inertial navigation module. However, with the improvement of chip integration, the heat generated by the chip ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the heat dissipation effect of the inertial navigation module is difficult and the effect is not good in the prior art, the present invention provides a heat dissipation device for the inertial navigation module, which can adopt a flow-pressure controlled parallel independent heat dissipation method to cope with different positions of the inertial navigation module. Cooling requirements for inertial navigation modules such as accelerometers and gyroscopes can be efficiently, intelligently and safely dissipated

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