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Light-emitting diodes and light-emitting diode packages

A technology for light-emitting diodes and packages, which is applied to electrical components, semiconductor devices, electric solid-state devices, etc., and can solve the problems of inability to effectively control color temperature and difficult to effectively combine colors.

Active Publication Date: 2021-05-07
SEOUL VIOSYS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the arrangement structure of a plurality of light-emitting units in the prior art, it is difficult to effectively combine the colors of the light emitted through the wavelength conversion layer in each light-emitting unit, and there is a problem that the color temperature cannot be effectively controlled.

Method used

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  • Light-emitting diodes and light-emitting diode packages
  • Light-emitting diodes and light-emitting diode packages
  • Light-emitting diodes and light-emitting diode packages

Examples

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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below are provided in order to fully convey the idea of ​​the present invention to those of ordinary skill in the technical field to which the present invention pertains. Therefore, the present invention is not limited to the Examples described below, but can be embodied in other forms. Also, in the drawings, the width, length, thickness, and the like of constituent elements may be shown exaggeratedly for convenience. In addition, when it is stated that one constituent element is located "on" or "on" another constituent element, it includes not only the case where each part is located "immediately above" or "immediately on" another part, but also the case where each constituent element is located When another constituent element is interposed between other constituent elements. Throughout the specification, the same reference numerals...

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Abstract

The invention relates to a light emitting diode and a light emitting diode package. A light emitting diode according to an embodiment of the present invention includes: a first light emitting region and a second light emitting region, respectively including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The active layer between the two conductive semiconductor layers; the ohmic reflective layer, located on the respective second conductive semiconductor layers of the first light emitting region and the second light emitting region; and the first pad metal layer, connected with the ohmic reflective layer The layers are separated and electrically connected to the first conductive semiconductor layer of the first light emitting region and the second light emitting region, and the second light emitting region surrounds the first light emitting region.

Description

technical field [0001] The invention relates to a light emitting diode, in particular to a light emitting diode comprising a plurality of light emitting regions. Background technique [0002] Light-emitting diodes (LEDs) are solid-state light-emitting elements that convert electrical energy into light. Light emitting diodes are widely used as light sources in backlight units, lighting devices, signal indicators, large displays, and the like. [0003] The light emitting diode according to the prior art may include a plurality of light emitting units, however, the light emitting diode according to the prior art has a structure in which the plurality of light emitting units are arranged up and down or left and right. In the light emitting diode having the above structure, the control of the directivity angle by controlling the driving of the plurality of light emitting units cannot be effectively performed. Furthermore, since each of the plurality of light emitting units has ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/08H01L33/50H01L33/48
CPCH01L33/08H01L33/48H01L33/504H01L27/15H01L33/64H01L33/60H01L33/502
Inventor 吴世熙金钟奎金贤儿
Owner SEOUL VIOSYS CO LTD
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