LIGHT EMITTING DIODE and light emitting diode package

A technology of light-emitting diodes and packages, which is applied in the direction of electrical components, semiconductor devices, electric solid-state devices, etc., and can solve the problems that color combination is difficult to carry out effectively, and color temperature cannot be effectively controlled.

Active Publication Date: 2018-09-25
SEOUL VIOSYS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the arrangement structure of a plurality of light-emitting units in the prior art, it is difficult to effectively combine the colors of the light emitted through the wavelength conversion layer in each light-emitting unit, and there is a problem that the color temperature cannot be effectively controlled.

Method used

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  • LIGHT EMITTING DIODE and light emitting diode package
  • LIGHT EMITTING DIODE and light emitting diode package
  • LIGHT EMITTING DIODE and light emitting diode package

Examples

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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below are provided in order to fully convey the idea of ​​the present invention to those of ordinary skill in the technical field to which the present invention pertains. Therefore, the present invention is not limited to the Examples described below, but can be embodied in other forms. Also, in the drawings, the width, length, thickness, and the like of constituent elements may be shown exaggeratedly for convenience. In addition, when it is stated that one constituent element is located "on" or "on" another constituent element, it includes not only the case where each part is located "immediately above" or "immediately on" another part, but also the case where each constituent element is located When another constituent element is interposed between other constituent elements. Throughout the specification, the same reference numerals...

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Abstract

The invention relates to a light emitting diode and a light emitting diode package. A light emitting diode includes a first light emitting region and a second light emitting region each comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer interposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, an ohmic reflective layer disposed on the second conductivity type semiconductor layer of each of the first and second light emitting regions, and a first pad metal layer separated from the ohmic reflective layer and electrically connected to the first conductivity type semiconductor layer of each of the first and second light emitting regions, wherein the second light emitting region surrounds the first light emitting region.

Description

technical field [0001] The invention relates to a light emitting diode, in particular to a light emitting diode comprising a plurality of light emitting regions. Background technique [0002] Light-emitting diodes (LEDs) are solid-state light-emitting elements that convert electrical energy into light. Light emitting diodes are widely used as light sources in backlight units, lighting devices, signal indicators, large displays, and the like. [0003] The light emitting diode according to the prior art may include a plurality of light emitting units, however, the light emitting diode according to the prior art has a structure in which the plurality of light emitting units are arranged up and down or left and right. In the light emitting diode having the above structure, the control of the directivity angle by controlling the driving of the plurality of light emitting units cannot be effectively performed. Furthermore, since each of the plurality of light emitting units has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/08H01L33/50H01L33/48
CPCH01L33/08H01L33/48H01L33/504H01L27/15H01L33/64H01L33/60H01L33/502
Inventor 吴世熙金钟奎金贤儿
Owner SEOUL VIOSYS CO LTD
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