Honeysuckle planting device and honeysuckle planting method

A planting device and Yinhua technology, which is applied to manual sowing tools, manure treatment, cultivation, etc., can solve the problems of cumbersome procedures and slow planting speed, and achieve the effects of increasing planting speed, reducing seeding procedures, and reducing manpower

Active Publication Date: 2018-11-06
湖南鸿利药业股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the process of planting the existing Silver Flowers, most of them are digging seed pits on the flat ground, then putting the seeds into the seed pits, and finally backfilling the soil, which is not only complicated in process, but also slow in planting speed

Method used

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  • Honeysuckle planting device and honeysuckle planting method
  • Honeysuckle planting device and honeysuckle planting method
  • Honeysuckle planting device and honeysuckle planting method

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0035] According to an embodiment of the present invention, a silver flower planting device and a planting method thereof are provided.

[0036] Such as Figure 1-5 As shown, a silver flower planting device according to an embodiment of the present invention includes a vehicle frame 1 on which a handle 2 is provided, and an end of the vehicle frame 1 away from the handle 2 is fixedly connected to the central shaft 3 , both ends of the central shaft 3 are movable with rollers 4, the frame 1 i...

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Abstract

The invention discloses a honeysuckle planting device and a honeysuckle planting method. The honeysuckle planting device comprises a frame, a handle is arranged on the frame, one end away from the handle, of the frame is fixedly connected with a spindle, rollers are movably arranged at two ends of the spindle, a placement plate is arranged on the frame, a planting mechanism is fixedly arranged onthe placement plate and includes a storage box, the storage box is fixed on the placement plate, a guide plate is arranged in the storage box and is matched with the same, a discharge pipe is arrangedunder the guide plate, the discharge pipe penetrates the storage box and the placement plate, one end of the discharge pipe and away from the guide plate is provided with a seal plug, a movable barrel is arranged in the discharge pipe, and an opening is arranged in the movable barrel. The honeysuckle planting device has the advantages that putting seeds into seed pits and final backfill are combined into one step, sowing process is reduced, manpower can be reduced, and planting speed is greatly increased.

Description

technical field [0001] The invention relates to the field of silver flower planting, in particular to a silver flower planting device and a planting method thereof. Background technique [0002] Silverflower is a plant. Honeysuckle is a perennial semi-evergreen twining woody vine, up to 9m long. Stems hollow, much branched, young branches densely pubescent and glandular hairy. Petiole 4-10cm long, densely pubescent; leaf papery, leaf blade ovate, oblong-ovate or ovate-lanceolate, 2.5-8cm long, 1-5.5cm wide, apex shortly pointed, acuminate or obtusely rounded , base round or nearly heart-shaped, entire, both sides and margins are pubescent. [0003] However, in the process of planting the existing Silver Flowers, most of them dig seed pits on the flat ground, then put the seeds into the seed pits, and finally backfill the soil, which is not only complicated in operation, but also slow in planting speed. [0004] Aiming at the problems in the related technologies, no eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01C7/02A01C5/02A01G17/00
CPCA01C5/02A01C7/02A01G17/005
Inventor 曹柳燕
Owner 湖南鸿利药业股份有限公司
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