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Stamping device with cloud platform control

A cloud platform and control board technology, applied in printing, stamping, etc., can solve the problems of low automation, single structure, and poor protection, and achieve the effect of high automation, convenient operation, and good protection

Inactive Publication Date: 2018-11-16
天津市硕丰科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a cloud platform control stamping device to solve the problems and deficiencies of single structure, poor practicability, low degree of automation, poor protection and easy misappropriation proposed in the background technology

Method used

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  • Stamping device with cloud platform control
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  • Stamping device with cloud platform control

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Experimental program
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Effect test

Embodiment approach

[0029] A device with cloud platform control and seal, including: battery 1, compression spring 2, seal 3, control main board 4, outer layer 5, electronic lock 6, inner layer 7, middle layer 8, indicator light 9, power button 10 and The data port 11; the battery 1 is arranged on the inner upper side of the outer layer 5 by a nesting method, and the right side of the battery 1 is provided with a control main board 4 which is electrically connected; the inner middle of the outer layer 5 is provided with a nesting method The compression springs 2 are connected, and the lower end of the compression spring 2 is provided with a seal 3 connected by pressing; the outer side of the seal 3 is provided with an inner layer 7 connected by clearance fit; the middle part of the outer layer 5 and the inner layer 7 The middle layer 8 is connected by an embedded method, and the outer layer 5 and the inner layer 7 are connected by screws; the upper right end of the outer layer 5 is provided with a...

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Abstract

The invention provides a stamping device with cloud platform control. The stamping device comprises a battery, a compression spring, a seal, a control main board and a data port; the battery is arranged on the inner upper side of an outer layer in a sleeving mode, and the control main board is arranged on the right side of the battery in an electrically connected mode; the compression spring is arranged on the inner side middle portion of the outer layer in a sleeving connected mode, and the seal is arranged at the lower end of the compression spring in a pressing connected mode; an inner layer is arranged on the outer side of the seal in a clearance fit connected mode; and the data port is arranged on the left side upper portion of the outer layer in an embedded connected mode, and the data port is electrically connected with the control main board. The stamping device has the advantages of excellent structure, high practicability, high degree of automation, good protection, safety and reliability by the structural improvement and combined with the prior art, the problems and deficiencies which are existed in an existing device are effectively solved, and more practicability is achieved.

Description

technical field [0001] The invention relates to the technical field of automatic stamping machines, and more particularly, to a stamping device controlled by a cloud platform. Background technique [0002] The seal has a long history and is a symbol of authority. In hospitals, banks and various production enterprises, it is often necessary to seal various documents, bills, etc. Enterprises basically still use manual stamping, which is not only slow, but also has a huge workload, which can easily lead to inaccurate positions when stamping. At present, the automatic stamping machines that have been produced on the market still have problems such as poor security that may be stolen. , Therefore, the research on a convenient, fast and automatic safe and reliable stamping machine has good practical value. [0003] Through observation, it is found that the existing technology experience platform with cloud platform control and seal device has problems such as single structure, po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41K1/58B41K1/36
Inventor 康炎
Owner 天津市硕丰科技股份有限公司
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