Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-end circuit board for information transmission

An information transmission and circuit board technology, applied in the field of high-end information transmission circuit boards, can solve the problems of unadjustable rotation direction, cumbersome and complicated fixed mode, affecting processing efficiency, etc., to improve processing quality and processing efficiency, simple structure, The effect of reducing the operation steps

Inactive Publication Date: 2018-11-23
广州轻舟科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the information age, some information transmission circuit boards with waterproof and anti-corrosion functions are widely used in the field of information integration. However, most of these circuit boards are cylindrical and need to be printed during processing and production. Hole operation, while the traditional circuit board processing device needs to use bolt fastening to fix the circuit board and punch holes. The fixing mode is cumbersome and complicated, and it is difficult. It is difficult to punch holes in the circumferential direction of the board, which seriously affects the processing efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-end circuit board for information transmission
  • High-end circuit board for information transmission
  • High-end circuit board for information transmission

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0024]Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0025] like Figure 1-5 As shown, a high-end circuit board for information transmission of the device of the present invention includes a drill shaft 10 connected to the driving device and a base 20 arranged below the drill shaft 10, and the top end surface of the base 20 is provided with a A connection groove 21, the left and right inner walls of the installation groove 21 are respectively provided with a first sliding connection cavity 22 an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-end circuit board for information transmission. The circuit board comprises a drill shaft and a base, wherein the drill shaft is in power connection with a driving device, and the base is arranged below the drill shaft; a mounting connection groove is formed in the end surface of the top of the base, a first sliding connection cavity and a second sliding connection cavity which are provided with upward openings are formed in the left inner wall and the right inner wall of the mounting connection groove, a first sliding connection frame is installed in the first sliding connection cavity in a sliding connection mode, a transfer device is arranged in the first sliding connection frame, a second sliding connection frame is installed in the second sliding connection cavity in a sliding connection mode, and a locking device is arranged in the second sliding frame; and a mounting connection frame which penetrates through the end surface of the top of the base and extends upwards is fixedly arranged in the inner bottom wall of the mounting connection groove, wherein a first transfer cavity is formed in the position, in the mounting connection groove, of themounting connection frame, and a first transfer shaft is installed in the first transfer cavity in a rotating mode.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a high-end circuit board for information transmission. Background technique [0002] With the rapid development of the information age, some information transmission circuit boards with waterproof and anti-corrosion functions are widely used in the field of information integration. However, most of these circuit boards are cylindrical and need to be printed during processing and production. Hole operation, while the traditional circuit board processing device needs to fix the circuit board with bolts and punch holes. The fixing mode is cumbersome and complicated, and it is difficult. It is difficult to drill holes in the circumferential direction of the board, which seriously affects the processing efficiency. Contents of the invention [0003] Aiming at the deficiencies of the above technologies, the present invention proposes a high-end circuit board for i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/16B26D7/02B26D7/06
CPCB26F1/16B26D7/02B26D7/06B26F2210/08
Inventor 聂值清方萌
Owner 广州轻舟科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products