Method for communicating with mobile phone based on low-cost GFSK chip

Abstract

The invention relates to a method for communicating with a mobile phone with a low-cost GFSK chip. The method comprises the following steps: S1, GFSK chip-mobile phone receiving: a, a GFSK chip sendsout a first data packet, wherein the first data packet comprises a BLE broadcast packet, and the BLE broadcast packet comprises a preamble 1 Byte, access address 4 Byte, data PDU and CRC check 3 Byte;and b, the mobile phone Bluetooth receives the first data packet after scanning the BLE radio packet; S2, the mobile phone sending-GFSK chip receiving: a, the mobile phone sends out the second data packet which comprises a GFSK chip data packet, the GFSK chip data packet comprises the preamble 3 Byte, the access address 3-5 Byte, data Payload and CRC check 2 Byte; and b, the GFSK chip receives the second data packet. Through the method disclosed by the invention, the industry barrier problem caused by high-cost Bluetooth chip is solved, and the low-cost chip can realize the bidirectional communication with the mobile phone.

Description

technical field [0001] The invention relates to the technical field of communication facilities, in particular to a method for communicating with a mobile phone based on a low-cost GFSK chip. Background technique [0002] At present, the Bluetooth chips on the market are all highly integrated Bluetooth 4.0 low-power single-mode devices, which integrate high-performance RF transceivers, basebands, ARM core microprocessors, rich functional peripheral units, programmable protocols and configuration files etc. to support smart wearables, indoor positioning ibeacon, and smart home BLE applications. However, due to the built-in powerful core unit of the Bluetooth chip, the cost is relatively high, and it cannot be applied in some cost-sensitive application fields, such as indoor positioning, remote controls, toys and other industries, which has caused a natural barrier to the comprehensive promotion of Bluetooth technology. Contents of the invention [0003] The technical probl...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved in the present invention is: in order to solve the problems existing in the above-mentioned background technology, provide a kind of method based on low-cost GFSK chip and mobile phone communication, simple operation, solve the industry barrier problem that the high-cost bluetooth chip brings, It enables low-cost chips to achieve two-way communication with mobile phones, which expands the scope of use of Bluetooth technology, and is completely convenient for people to use, and is convenient for widespread promotion and use.

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