Epoxy resin composition

Abstract

The invention discloses an epoxy resin composition. The epoxy resin composition is prepared from the following raw materials in percentage by weight: 40 to 50 percent of epoxy resin, 0.1 to 1 percentof dimethylimidazole, 0.1 to 3 percent of decabromodiphenyl ether, 0.1 to 3 percent of PE (Polyethylene) wax, 0.1 to 3 percent of nano zirconium dioxide and 40 to 60 percent of dicyandiamide. The epoxy resin composition has the characteristics of heat resistance, excellent toughness, low water absorption performance and self-flame-retarding performance.

Description

technical field [0001] The invention belongs to the technical field of material science, and in particular relates to an epoxy resin composition. Background technique [0002] Epoxy resins generally refer to molecules containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton, and can be used in appropriate chemical reagents (curing agents) through epoxy groups. ) is a general term for compounds that react to form a three-dimensional network cured product in the presence of Epoxy resins are widely used as adhesives in printed circuit board (PCB) materials due to their good chemical stability, electrical insulation, corrosion resistance, cohesiveness, and mechanical strength. [0003] In the PCB substrate material with glass fiber cloth as the reinforcement material, the FR-4 board of the usual epoxy system is cured with dicyandiamide (DICY), and the board has good processability, but this kind of board has high hygro...

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Problems solved by technology

[0005] It can be seen that the prior art has a prejudice against the application of nitrogen-containing organic solvents in epoxy resin adhesives, and the present invention has improved the invention aimed at the deficiencies of the prior art